三利谱：AR/VR头显折叠光路用偏光片已量产出货
8月6日，三利谱在互动平台表示，公司AR/VR头显折叠光路用偏光片产品已实现量产出货并仍在持续迭代。
07
Aug
07
Aug
传三星将供微软数十万片OLEDoS
Apple Vision Pro配备索尼OLEDoS面板。三星显示宣布将Microsoft 的下一代混合现实 （MR） 设备使用微型有机发光二极管 （OLED） 。
07
Aug
友达：已有Micro LED大尺寸电视量产出货
友达表示，公司在7、8年前就有发展FOPLP（面板级扇出型封装技术），不过内部认为其附加价值不高、竞合关系复杂、市场成长性低，所以暂时搁置，并先专注发展Micro LED技术，目前已有大尺寸电视量产出货，市面上可买到。
07
Aug
鸿海斥资2.2亿元收购华云光电70%股权
8月5日，鸿海旗下鸿腾精密科技宣布，以人民币2.2亿元（约新台币10.18亿元）收购山东华云光电技术有限公司70%的股权。此次收购将进一步加速鸿海集团在高速光模组与共封装光学模组（CPO）技术与市场的布局，以应对人工智能（AI）需求激增带来的光通讯市场。
07
Aug
兆驰股份上半年净利润9.11亿元！同比上涨24.04%
8月5日公告，2024年上半年营业收入95.2亿元，同比增长23.07%；归母净利润9.11亿元，同比增长24.04%；基本每股收益0.2元。报告期内，在传统业务智慧显示终端稳定增长的同时，LED产业链净利润贡献占比超过50%。在智慧显示领域，出货量实现稳中有升。
06
Aug
WT Microelectronics forecasts semiconductor market rebound by 2025 despite current challenges
On August 6th, WT Microelectronics, a leading IC distributor based in Taiwan, held its investor conference where Chairman Simon Cheng expressed confidence that current semiconductor market headwinds are only a short-term phenomenon.
06
Aug
SK Hynix secures US$450 million in US CHIPS Act funding for HBM memory fab
The US Department of Commerce and SK Hynix have signed a non-binding preliminary memorandum of terms to provide up to US$450 million in proposed federal incentives under the CHIPS and Science Act to establish a high-bandwidth memory (HBM) advanced packaging fabrication and R&D facility in Indiana.
06
Aug
UK government scraps US$1.7 billion in AI and supercomputer funding
One month into the UK’s new Labour government taking office, the shelving of key AI projects has signalled a major shift in the country’s tech policies. Recent reports indicate that the new government plans to scrap two major computing infrastructure projects collectively worth GBP1.3 billion (US$1.7 billion).
06
Aug
Indian opto-semiconductor maker acquires US-based IC equipment company
Indian opto-semiconductor supplier Polymatech has announced the acquisition of a US-based semiconductor equipment provider specializing in packaging and testing. This move is part of Polymatech’s broader strategy to build an integrated chipmaking business that spans multiple sectors.
06
Aug
Honor denies rumors of government-backed IPO amid China’s slowing capital market
Amid a slowing Chinese IPO market due to regulatory tightening and economic uncertainties, reports suggest that Honor is planning to go public after securing substantial government support, a claim the company has denied.