03
Jul
03
Jul
MSI MAG 32CQ6PF is unveiled with a 180Hz QHD curved VA display
02
Jul
Telecoms face transformation challenges amid slow 5G growth
Telecom operators worldwide are grappling with the challenges of transformation amid the slow growth and lack of a killer app for 5G.
02
Jul
BYD sales rise to a record on price cuts, tech upgrades
BYD Co. sold a record number of electric and hybrid cars in the second quarter, sales data compiled by Bloomberg News shows, as price cuts and new technology stoked consumers into purchases.
02
Jul
Samsung Union plans three-day walkout in push for better pay
The largest union at Samsung Electronics Co. said it will stage a three-day walkout beginning July 8, adding to the challenges for South Korea’s largest company as it seeks to recover from setbacks in its semiconductor business.
02
Jul
Malaysia and Singapore vie for semiconductor supremacy in SEA amid global supply chain shifts
As the global supply chain undergoes restructuring, Malaysia and Singapore have emerged as attractive destinations for semiconductor companies seeking to establish manufacturing operations in Southeast Asia (SEA). Both countries have implemented their own strategies to capitalize on this opportunity, leveraging their respective strengths to enhance their value within the semiconductor industry chain.
02
Jul
Sony to scale down BD production business in Sendai
Sony’s optical disc business is facing challenges due to declining demand as data storage methods shift towards cloud-based solutions and plans to cut its workforce by 40%.
02
Jul
Unitech PCB upbeat about LEO satellite demand
Unitech Printed Circuit Board has expressed optimism about the demand for Low-Earth Orbit (LEO) satellites. Revenue generated from the sector will significantly surpass the previous year’s level in 2024, according to company VP Kanty Wu.
02
Jul
Chinese manufacturers to benefit from CoWoS-like structures and TSMC order surplus
Taiwan Semiconductor Manufacturing Company (TSMC) remains the world’s sole provider capable of delivering a complete end-to-end Chip-on-Wafer-on-Substrate (CoWoS) packaging solution. For Chinese manufacturers, the question arises: what roles do front-end wafer fabrication and advanced packaging companies play, and which markets do they serve?
02
Jul
Samsung announces R&D progresses in India
Samsung announced progress in its research and development activities in India, emphasizing its commitment to continuing to expand its presence in the country.