友达：扇出型面板级封装并非新话题，其普及受限于成本结构
扇出型面板级封装（FOPLP）技术近期在台积电宣布投入研究后，成为市场热门话题。群创也因FOPLP的量产受到关注。友达总经理柯富仁近日表示，FOPLP在行业中并非新话题，友达早已有所投入，过去未能大规模普及主要与成本结构有关。如今，随着AI芯片尺寸的增大，出现了耗能和散热问题，使得FOPLP的优势愈加突出，但是否能成为主流还有待观察。
05
Aug
05
Aug
捕获原子充当晶体管，新型纳米光子电路显示量子网络潜力
8月5日消息，美国普渡大学团队将碱金属原子（铯）捕获在集成光子电路中，可充当光子（光的最小能量单位）的晶体管。
05
Aug
05
Aug
05
Aug
快报 | 工业富联：上半年净利润87.39亿元，同比增长22.04%
工业富联(601138)8月4日晚间发布业绩快报，2024年半年度营业总收入为2660.91亿元，同比增长28.69%；归母净利润87.39亿元，同比增长22.04%；基本每股收益0.44元。
05
Aug
3.48亿元！春秋电子拟转让南昌春秋65%股权给华勤技术
7月30日，春秋电子（603890）发布公告称，公司拟向上海摩勤智能技术有限公司(以下简称“上海摩勤”)转让控股子公司南昌春秋电子科技有限公司(以下简称“南昌春秋”)65%股权，交易金额为人民币3.48亿元。
02
Aug
Transcend expects rising demands for memories in 2H24
Transcend Information reported consolidated revenue of NT$2.33 billion (US$71.05 million) for the second quarter of 2024, a 14.7% decrease from the previous quarter and a 5.6% decrease year-on-year. The company also posted a net profit of NT$716 million, down 11.3% from the first quarter.
02
Aug
Microsoft Azure attack shows persistence of blunt hacking tool
The recent outage on Microsoft Corp.’s cloud-computer platform demonstrated the persistence of an older, blunt-force style of cyberattack.
02
Aug
Samsung joins funding for AI security startup valued at US$400 million
Protect AI Inc., a security and artificial intelligence startup, has raised US$60 million from investors betting that the intersection of AI and security will be big business.
02
Aug
Geopolitics prompts IQE to step up global deployment
Compound semiconductor epitaxial wafer (epi-wafer) manufacturer IQE is swiftly adjusting its global strategy by expanding outside its UK base in response to geopolitical volatility and supply chain restructuring. The company has also applied for government subsidies in the US and EU to increase its gallium nitride (GaN) capacity.