据了解,日前国内头部面板厂商维信诺已完成世界首颗采用嵌入式RRAM(Resistive Random Access Memory,阻变存储器)存储技术AMOLED显示驱动芯片的开发和认证。该新型AMOLED显示驱动芯片由维信诺与驱动芯片设计公司昇显微电子联合开发,存储器设计公司睿科微电子提供技术支持。
As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology used in this field. Memory manufacturers Samsung Electronics and SK Hynix are reportedly collaborating with partners to develop these next-generation solutions.