DIC 2024丨京东方、惠科、维信诺、天马、和辉、JDI等面板厂展品一览
7月2日至5日，2024年中国国际显示产业高峰论坛暨国际显示技术及应用创新展（DIC 2024）在上海隆重举办。BOE（京东方）、HKC惠科、彩虹、维信诺、天马微电子、和辉光电、龙腾光电、JDI等面板厂齐聚，都展示了哪些黑科技，让我们一起来看一看。
09
Jul
09
Jul
京东方A：拟申请注册发行不超100亿元中期票据和超短期融资券
京东方A(000725)7月8日晚间公告，为拓宽公司融资渠道，满足生产经营与投资的资金需求，优化债务结构，合理控制财务成本，同时考虑国内宏观经济形势的变化，公司拟通过向交易商协会申请注册发行中期票据和超短期融资券的方式筹集资金，拟注册的债务融资工具总额不超过人民币100亿元。
09
Jul
晶合集成与上海精测签署20台量测国产设备采购意向
据“晶合集成”，7月9日，晶合集成与上海精测半导体技术有限公司（以下简称上海精测）举行EPROFILE 300FD量测机台采购意向签约仪式。
09
Jul
华映科技：拟注销全资子公司华映纳闽
7月8日，华映科技(000536)(000536.SZ)公布，公司2024年7月5日召开第九届董事会第十六次会议，审议通过了《关于注销全资子公司的议案》，同意注销全资子公司华映科技(纳闽)有限公司(以下简称”华映纳闽”)，公司董事会授权董事长全权办理相关事项。
08
Jul
Taiwanese aerospace SMEs navigate certification hurdles, eyeing global markets
Taiwan’s small and medium-sized enterprises (SMEs) in aerospace manufacturing face a unique challenge: the high cost of obtaining necessary certifications.
08
Jul
India IC startup secures US$5 million funding
iVP Semi, an India-based IC design house, has recently been established and has secured US$5 million in pre-Series A funding. The startup plans to leverage this investment to establish a production testing facility in Chennai and another undisclosed location in South India.
08
Jul
AI advances propel bipedal robots: Japan lags as US and China lead breakthroughs
While Japanese manufacturers have long been at the forefront of bipedal humanoid robot development, recent AI breakthroughs from the US and China’s IT industry have propelled these innovations forward. Rows of bipedal robots showcased by tech companies at AI industry events have captivated global attention.
08
Jul
UMC reports mixed financial results amid market challenges
Pure-play foundry United Microelectronics (UMC) has reported a revenue of NT$17.55 billion (US$541.1 million) for June 2024, marking a 10.5% sequential decline and a 7.9% decrease YoY. Despite this monthly dip, UMC’s revenue for Q2 2024 reached NT$56.8 billion, representing a 4% increase from the previous quarter. The revenue for the first half of this year totaled NT$111.43 billion, showing a modest 0.8% increase from the previous year.
08
Jul
Japan-based Horiba to establish semiconductor measuring equipment facility in western India
According to Business Standard, Japan-based Horiba, a major player in the global semiconductor industry, plans to establish a manufacturing facility in India. This plant will cater to the growing domestic market for chip fabrication, assembly, and testing, as well as for export.
08
Jul
TSMC subsidiary JASM to double hiring for new chip factories in Japan
Japan Advanced Semiconductor Manufacturing (JASM), a subsidiary of Taiwan Semiconductor Manufacturing Company (TSMC), is set to significantly increase its workforce in spring 2025. The company plans to hire over 600 new employees, more than doubling its intake compared to early 2024. This substantial boost in recruitment is aimed at staffing two new semiconductor factories in Kumamoto Prefecture, Japan. The first facility is scheduled to commence chip production in 2024, with the second planned to open in 2027.