Samsung establishes HBM development team as first major change under new DS division head

Under the guidance of newly appointed head Young Hyun-Jun, Samsung Electronics’ Semiconductor and Device Solutions (DS) division is reportedly enhancing its competitiveness in high-bandwidth memory (HBM) and advanced packaging (AVP) through strategic organizational restructuring and reforms. According to ZDNet Korea, the DS division’s recent reorganization primarily focuses on HBM, AVP, and the Equipment Technology Research Institute.

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BEV sales to hit 10 million in 2024, says Counterpoint

Battery electric vehicles (BEVs) are set to reach the 10-million milestone in 2024, marking a significant achievement for the global passenger vehicle market, according to Counterpoint. This milestone will coincide with the resumption of the long-term decline for internal combustion engine (ICE) vehicles, whose market share is expected to fall below 50% within four years, the research firm said.

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Taiwan OSATs poised to rebound on robust AI, HPC chip demand

Taiwan’s major outsourced semiconductor assembly and test (OSAT) service providers, including ASE Group, Powertech Technology, King Yuan Electronics (KYEC), and Sigurd Microelectronics, are expected to see their performance gradually stabilize in the coming months. Supply chain sources suggest that these companies are likely to perform better in 2024 than in 2023, driven by robust demand for high-performance computing (HPC) and artificial intelligence (AI) chips.

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Vietnam reportedly misses billions of investments due to insufficient subsidies

Vietnam’s cautious approach to offering investment incentives may have cost the country billions of dollars in potential economic benefits and development. According to reports from Reuters and Vietnamnet, citing an official document from Vietnam’s Ministry of Planning and Investment, major tech companies like Intel and LG Chem bypassed Vietnam for their multi-billion dollar projects due to insufficient investment incentives.

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