华映科技：拟注销全资子公司华映纳闽
7月8日，华映科技(000536)(000536.SZ)公布，公司2024年7月5日召开第九届董事会第十六次会议，审议通过了《关于注销全资子公司的议案》，同意注销全资子公司华映科技(纳闽)有限公司(以下简称”华映纳闽”)，公司董事会授权董事长全权办理相关事项。
09
Jul
08
Jul
Taiwanese aerospace SMEs navigate certification hurdles, eyeing global markets
Taiwan’s small and medium-sized enterprises (SMEs) in aerospace manufacturing face a unique challenge: the high cost of obtaining necessary certifications.
08
Jul
India IC startup secures US$5 million funding
iVP Semi, an India-based IC design house, has recently been established and has secured US$5 million in pre-Series A funding. The startup plans to leverage this investment to establish a production testing facility in Chennai and another undisclosed location in South India.
08
Jul
AI advances propel bipedal robots: Japan lags as US and China lead breakthroughs
While Japanese manufacturers have long been at the forefront of bipedal humanoid robot development, recent AI breakthroughs from the US and China’s IT industry have propelled these innovations forward. Rows of bipedal robots showcased by tech companies at AI industry events have captivated global attention.
08
Jul
UMC reports mixed financial results amid market challenges
Pure-play foundry United Microelectronics (UMC) has reported a revenue of NT$17.55 billion (US$541.1 million) for June 2024, marking a 10.5% sequential decline and a 7.9% decrease YoY. Despite this monthly dip, UMC’s revenue for Q2 2024 reached NT$56.8 billion, representing a 4% increase from the previous quarter. The revenue for the first half of this year totaled NT$111.43 billion, showing a modest 0.8% increase from the previous year.
08
Jul
Japan-based Horiba to establish semiconductor measuring equipment facility in western India
According to Business Standard, Japan-based Horiba, a major player in the global semiconductor industry, plans to establish a manufacturing facility in India. This plant will cater to the growing domestic market for chip fabrication, assembly, and testing, as well as for export.
08
Jul
TSMC subsidiary JASM to double hiring for new chip factories in Japan
Japan Advanced Semiconductor Manufacturing (JASM), a subsidiary of Taiwan Semiconductor Manufacturing Company (TSMC), is set to significantly increase its workforce in spring 2025. The company plans to hire over 600 new employees, more than doubling its intake compared to early 2024. This substantial boost in recruitment is aimed at staffing two new semiconductor factories in Kumamoto Prefecture, Japan. The first facility is scheduled to commence chip production in 2024, with the second planned to open in 2027.
08
Jul
Taiwanese PA chip makers see strong demand from China and US
As the smartphone industry enters its peak shipment season in the second half of 2024, major brands are launching new devices. Taiwan’s power amplifier (PA) chip supply chains, including Win Foundry, AWSC, and VPEC, are experiencing impressive sales results.
08
Jul
Samsung establishes HBM development team as first major change under new DS division head
Under the guidance of newly appointed head Young Hyun-Jun, Samsung Electronics’ Semiconductor and Device Solutions (DS) division is reportedly enhancing its competitiveness in high-bandwidth memory (HBM) and advanced packaging (AVP) through strategic organizational restructuring and reforms. According to ZDNet Korea, the DS division’s recent reorganization primarily focuses on HBM, AVP, and the Equipment Technology Research Institute.
08
Jul
BEV sales to hit 10 million in 2024, says Counterpoint
Battery electric vehicles (BEVs) are set to reach the 10-million milestone in 2024, marking a significant achievement for the global passenger vehicle market, according to Counterpoint. This milestone will coincide with the resumption of the long-term decline for internal combustion engine (ICE) vehicles, whose market share is expected to fall below 50% within four years, the research firm said.