Geopolitics push AI chip packaging into Taiwan-US duopoly

Geopolitical realignments are accelerating a reshaping of the global outsourced assembly and test (OSAT) landscape. Industry analysts say that over the next five years, advanced AI-chip packaging capacity will consolidate around two critical hubs: Taiwan and the United States. The key beneficiaries are expected to be ASE Holdings and Siliconware Precision Industries (SPIL) in Taiwan, and Amkor Technology in the US and South Korea.

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Samsung reportedly gains momentum in foundry and memory with improved 4nm yields

Samsung Electronics is reportedly gaining momentum across its foundry and memory operations as higher yields on its 4nm process and a broad recovery in DRAM demand position the company for a strong finish to 2025. South Korean analysts expect operating profit to reach as much as KRW19 trillion (US$13 billion) in the fourth quarter of 2025, significantly above market expectations.

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Yeong Guan boosts global wind presence with China surge and 2026 Thailand plant launch

Taiwan’s major castings supplier Yeong Guan Energy Technology Group, a key producer of components for wind turbines, machine tools, and heavy industrial equipment, is deepening its presence in China’s rapidly expanding wind power market while advancing its Southeast Asia strategy. The company is set to complete its new Thailand plant by late 2025, with mass production scheduled to begin in 2026.

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SK Hynix reportedly delays HBM4 mass production amid Nvidia Rubin AI accelerator launch plans

SK Hynix has reportedly postponed the mass production timeline for its sixth-generation high bandwidth memory (HBM4) from the end of the second quarter of 2026 to the third quarter of 2026, coinciding with Nvidia Corporation’s planned 2026 launch of its “Rubin” AI accelerator that will use HBM4. The delay appears to be a strategic adjustment influenced by ongoing market demand and supply negotiations.

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Arbor and Adlink lay out 2026 strategies in edge AI

The largest determining factor for whether AI compute can be industrialized and achieve commercial viability will depend on the deployment speed of edge AI and industrial IoT (IIoT) between 2026 and 2027. On December 2, 2025, industrial PC (IPC) companies Arbor Technology and Adlink Technology both highlighted in their earnings calls that AI will be a major driver of application growth, and 2026 is targeted as the year of operational breakout. Both companies are actively investing in high-end edge computing platforms and vertical-market applications.

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Taiwan emerges as leading supplier of medical displays and X-ray sensors

Taiwan has become the world’s top supplier of medical displays and X-ray sensors as AUO and Innolux accelerate expansion in healthcare technologies and boost shipments to global customers. Shih-Hong Liao, general manager of AUO’s Smart Healthcare Business Group, said Taiwan now holds nearly 60% of the global medical display market and about 70% of the X-ray sensor market.

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South Korea bets on airport GSE to break 90% power chip import lock

South Korea is racing to slash its more than 90% dependence on imported power semiconductors. Industry leaders warn that this reliance threatens the country’s competitiveness in electric vehicles (EVs), data centers, and emerging mobility markets. Airport ground support equipment (GSE) has emerged as a strategic platform to validate and scale domestic power semiconductor technologies.

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Taiwan’s ESMT sees memory upturn accelerating as pricing gains roll into 4Q25

Tight memory supply has lifted prices across product lines, allowing Elite Semiconductor Microelectronics Technology (ESMT) to break a two-quarter losing streak in the third quarter of 2025. With wafer cycles running four to six months and contract pricing lagging by a quarter, the real pricing uplift is expected to appear from the fourth quarter of 2025. ESMT is on track to return to core profitability, with gross margin set to rise materially from third-quarter levels.

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