In recent years, Fan-Out Panel-Level Packaging (FOPLP) technology has become a rare opportunity for OSATs and other industry participants to compete with TSMC, Samsung Electronics, and Intel in the advanced packaging field.
Bangalore, often dubbed India’s Silicon Valley, has long been the heart of the country’s semiconductor industry, attracting heavyweight corporations and pioneering startups. This vibrant hub has been integral to India’s technological ascendancy for years.