因设备交付延误！韩媒称DMS向LGD支付了超200万元的迟延赔偿金
5月24日，据韩媒报道，韩国设备厂商DMS向LG Display支付了4亿韩元（约合人民币211.6万元）的迟延赔偿金，但对于其二级分包商A公司提起了高达150亿韩元（约合人民币7935万元）的诉讼。
24
May
24
May
群创已备好面板级扇出型封装产能，今年可顺利量产
5月24日消息，据台湾地区媒体报道称，由于CoWoS（Chip-on-Wafer-on-Substrate）产能不足，近日辉达宣布GB200芯片将提早在2025年使用面板级扇出型封装。而群创已经备好面板级扇出型封装的产能，今年就可顺利量产。
24
May
24
May
24
May
传苹果20英寸可折叠MacBook，LGD独家供应，成本直逼Vision Pro
昨日，有业内人士称，LG计划在2025年第四季度开始为配备18.8英寸或20.2英寸可折叠屏幕的MacBook量产显示面板。
24
May
OPPO Reno12/Pro手机发布：采用四曲柔边直屏，售价2699元起
5 月 23 日下午，OPPO 正式发布了 OPPO Reno12 系列手机，采用四曲柔边直屏，售价 2699 元起。
24
May
京东方华灿珠海Micro LED项目洁净间清扫完成、横琴总部乔迁
5月20日，京东方华灿光电珠海Micro LED晶圆制造和封装测试基地项目设备搬入仪式前的重要节点——洁净间清扫仪式圆满举行。
23
May
Seven hours in Geneva hotel highlights US-China struggle on AI
For seven hours at a Geneva hotel earlier this month, top US and Chinese officials locked into talks on collectively managing their biggest fears around artificial intelligence — while keeping up a cutthroat competition to dominate technology that promises to reshape the global economy.
23
May
Samsung reportedly invests in 2nm mobile AP development
Samsung Electronics is reportedly investing in developing 2nm mobile Application Processors (AP), a technology that has yet to be commercialized.
23
May
Samsung’s HBM lag threatens memory chip dominance in AI Era
Despite Samsung Electronics recently appointing a new leader for its Device Solutions (DS) division that comprises memory and foundry units, the company’s lag behind SK Hynix in leading the High Bandwidth Memory (HBM) market could become a major obstacle to its semiconductor business amid the widespread adoption of Artificial Intelligence (AI), as noted by industry insiders in South Korea.