China foundry CanSemi Technology has recently kicked off its third-phase expansion plan at its 12-inch wafer fab in Guangzhou, southern China with total investment of CNY16.25 billion (US$2.355 billion), aiming to build specialty process platform for analog chips for industrial and automotive applications.

China-based panel makers, including China Star Optoelectronics Technology (CSOT), BOE Technology and Visionox Technology, have stepped up their deployments in the automotive and OLED display segments to mitigate the impact of shrinking LCD panel sales, according to industry sources.

IC design houses are generally pessimistic about PC demand for the rest of 2022, with recovery not expected until the first half of 2023, according to industry sources.

Intel has been keen on pursuing the most advanced technology, but has not been as quick to make decisions as TSMC when it comes to responding flexibly to market needs. Intel could sell processed wafers at very high prices, but TSMC must use competitive pricing to attract widespread adoption by customers. And there’s also consideration about yield rates.