22
May
22
May
Audi partners with SAIC to develop China-specific EV platform; first vehicle to come next year
Premium carmaker Audi has deepened ties with its Chinese partner SAIC Motor as Western automakers try to catch up in the world’s largest EV market.
22
May
UMC starts equipment move-in at new phase of Singapore fab
UMC has kicked off equipment move-in at the third phase (Phase 3) of its Fab 12i in Singapore, according to the pure-play foundry.
22
May
Csun contributes to advanced packaging supply chain, says company president
PCB and semiconductor equipment specialist Csun Manufacturing plays an important role in the supply chain for advanced 2.5D and 3D IC packaging, said company president Frank Liang at a recent shareholder meeting.
22
May
Huawei’s automotive business unit profits in 1Q24
Five years after commencing its automotive ambition, Huawei said the unit has come out of the red. Richard Yu, Huawei’s chairman of the smart car solutions business unit, recently said the company’s automotive business unit and the smart selection car segment have turned profitable in the first quarter of 2024.
22
May
Kaynes Tech expects OSAT business to begin operation in two years
Amid the investment hype among India-based companies in the semiconductor field, Kaynes Technologies said its OSAT project witnessed delays due to the ongoing elections in India, with initial production planned for one or two years from now.
22
May
Taiwan seeks new funding solution for AMD’s R&D center subsidy
The government will withhold approval of AMD’s application to establish an R&D center in Taiwan until the source of related subsidy funding, potentially covering 35-40% of the US chipmaker’s investment, is secured, according to Chou Chung-bin, deputy director of the Department of Industrial Technology (DoIT) under the Ministry of Economic Affairs (MOEA).
22
May
Taiwan’s new president takes hard line on Beijing, eyes economic resilience
Lai Ching-te has officially assumed office as the 16th President of Taiwan, signaling a firm stance towards Beijing. His inaugural speech made clear that the new administration will not compromise on its position, suggesting that the current economic and industrial ties across the Taiwan Strait will remain largely unchanged. This hardline approach implies limited room for further deterioration and scant chances for improvement in relations.
22
May
Research Insight: G2 creates opportunities for diversified development of Vietnamese chip industry, but challenges remain
While the US-China technology rivalry and the resultant G2 framework have prompted the semiconductor industry to diversify production risks, Vietnam is emerging as an attractive location for global semiconductor players to serve the purpose, ranking closely behind Singapore and Malaysia among ASEAN countries. Nevertheless, there exist challenges that must be overcome to fully realize its potential.
22
May
Samsung sees second senior leadership shuffle amidst HBM lag, organizational restructuring imminent
In less than six months, Samsung Electronics experienced yet another notable shift in its senior leadership, coinciding with its trailing position behind SK Hynix in the HBM market. This development hints at the possibility of additional organizational restructuring within Samsung’s semiconductor division.