Apple and Broadcom have extended their custom-chip partnership through 2031 under agreements expected to exceed US$30 billion, reinforcing Broadcom’s position as a critical Apple chip supplier.
Luxshare Precision’s highly anticipated Hong Kong debut got off to a shaky start despite securing the city’s largest IPO of 2026, underscoring investor skepticism over the Apple supplier’s long-term transformation strategy.
TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly output will reach at least 200,000 wafers in 2027. Equipment makers are still waiting for TSMC to finalize order allocation, a delay that is raising fears of price-cutting competition and delivery delays, as lead times run at least seven to nine months.
China’s AI model race is moving beyond parameter size, benchmark rankings and user buzz. Investors are now asking which companies can turn model spending into durable revenue, pricing power and enterprise workflows.
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