11
Jul
Apple’s decision to sue OpenAI for trade-secret theft does more than escalate a soured partnership between two of technology’s most influential companies. It injects legal uncertainty into OpenAI’s push to build its own consumer hardware — an effort a growing roster of Asian suppliers has already begun to serve, and it lands just as the AI developer approaches a closely watched initial public offering.
11
Jul
Mobilint touts NPU for physical AI, with CEO urging South Korea to accelerate development
South Korean AI semiconductor startup Mobilint is gaining traction in physical AI with its neural processing units (NPU) for edge devices, as the AI boom spreads from cloud computing into robots, autonomous vehicles and drones. Mobilint CEO Shin Dong-joo (transliterated from Korean) and other industry figures say the next two to three years will be a crucial window for South Korea to capture the physical AI market through NPU technology.
11
Jul
China recovers Long March 10B booster in reusable rocket milestone
China marked a major step in rocket reusability on July 10, 2026, after successfully recovering the first-stage booster of its Long March 10B rocket following an orbital launch mission.
11
Jul
China’s temporary helium export ban signals fears of a prolonged Middle East supply squeeze
China moved on July 10 to wall off its domestic supply of helium, a gas with no substitute in chipmaking and medical imaging, in a step that suggests Beijing does not expect Middle East supply risks to ease quickly — and one that could tighten an already strained global market.
11
Jul
Nvidia’s Jensen Huang to revisit Sega roots in Japan as AI PC competition intensifies
Nvidia CEO Jensen Huang will travel to Japan for an event celebrating the US chipmaker’s three-decade relationship with Sega, revisiting a partnership that helped Nvidia survive its difficult early years as semiconductor competition expands from data centers to personal computers.
10
Jul
The LG UltraGear G5 lineup is expanded with a trio of 24.5-inch models, led by the LG 25G550B
10
Jul
Acer Nitro XV275X Abiippr debuts as a 5K hybrid monitor, built for creative work and gaming
10
Jul
ASE Holdings posts record 2Q26 revenue, bets US$40M on South Korea as AI packaging demand surges
ASE Holdings posted record second-quarter and first-half 2026 revenue, driven by strong demand for advanced semiconductor packaging and testing, conventional backend services and AI-related applications. June revenue reached its second-highest monthly level on record, while quarterly growth exceeded the company’s previous guidance.
10
Jul
SK Hynix breaks Alibaba’s US listing record — but HBM customers will wait until 2028 for the capacity it funds
SK Hynix has priced a US$26.5 billion Nasdaq offering, giving the world’s leading supplier of high-bandwidth memory fresh capital to expand DRAM wafer production, advanced packaging and leading-edge manufacturing equipment at the same time.
10
Jul
Largan samples CPO product in July 2026, eyes GC edge
Largan said on July 9, 2026, that it will formally begin sampling fiber array (FA) products for a mass-production customer in July, while chairman En-Ping Lin outlined the company’s advantages in common packaging optics (CPO) amid market attention on Corning’s Glass Bridge technology.