24
Nov
Ongoing US-China tensions have sparked the most significant automotive supply chain shift in decades. Disruptions at semiconductor maker Nexperia have pushed US automakers to cut reliance on Chinese parts, while Taiwanese electronics suppliers ramp up local production to meet rising demand from American companies.
24
Nov
Foxtron’s Bria vehicle model makes its debut
Despite various rumors and external pressures, Foxtron still showcased multiple planned vehicle models at the 2025 Hon Hai Tech Day (HHTD). Among them, the most anticipated was Model B, originally scheduled for release in 2025.
24
Nov
China’s LFP price war curb meets industry skepticism
China’s Industrial Association of Power Sources (CIAPS) recently issued a Notice on Referencing the Lithium Iron Phosphate Cost Index and Regulating Industry Development, an effort to halt a years-long price war in lithium-iron-phosphate (LFP) materials. By proposing a “cost red line,” the association hopes to curb destructive price-cutting and restore a basic sense of pricing discipline to a market that has become increasingly chaotic.
24
Nov
Japan to become majority stakeholder in Rapidus with JPY100 billion investment
Japan’s Ministry of Economy, Trade and Industry plans to invest JPY100 billion (US$671 million) in Rapidus in fiscal 2025, securing a controlling stake as the government accelerates its push to rebuild domestic advanced chip manufacturing. The funding will be executed through the Information-Technology Promotion Agency, and Rapidus aims to reach break-even around 2030 and pursue an initial public offering in 2031.
24
Nov
Nvidia shifts to LPDDR for AI servers, Samsung poised to benefit most
Nvidia is reportedly adopting low-power DDR (LPDDR) memory in its servers to enhance power efficiency, marking a major shift in memory architecture. Industry analysts suggest this move could elevate LPDDR to become a core semiconductor in the AI era, following the prominence of high-bandwidth memory (HBM).
24
Nov
When EV know-how meets humanoid robots: Chinese automakers’ pivot to ‘physical AI’
China’s electric vehicle (EV) makers are shifting more of their R&D toward humanoid robots, betting the next phase of AI competition will centre on physical-world applications rather than in-car systems. As US-China tech tensions rise, automakers including Xpeng, Chery, Nio, BYD, GAC, and Seres are using their EV engineering and autonomous-driving AI to develop robots with autonomous mobility and semantic understanding, positioning embodied intelligence as their next strategic arena.
24
Nov
Nvidia’s move into mobile memory sparks supply and price concerns
Nvidia plans to incorporate mobile-grade LPDDR memory into future AI servers, a shift that could trigger a severe supply squeeze and drive prices significantly higher through 2026. Market researchers warn that the move to reduce power consumption may strain global inventory and intensify shortages across the wider electronics sector.
24
Nov
CMC readies Taiwan launch of next-gen XForce SUV, ET35 double-cab commercial vehicle
CMC, a Yulon Group subsidiary, detailed its 2026 product and market roadmaps during an online investor briefing on November 20, outlining new model launches and deeper strategic partnerships. Executive vice president Ching-wu Chien confirmed that Mitsubishi’s next-generation XForce SUV will make its official Taiwan debut at the 2026 Taipei Auto Show, which runs from December 31, 2025, to January 4, 2026.
24
Nov
India roundup: Fujifilm to build semiconductor materials factory in India, targeting regional exports
Fujifilm will build a semiconductor materials plant in India for regional exports; Ziroh Labs promotes CPU-first AI compute; India approves 17 ECMS projects worth US$810 million to expand component manufacturing.
24
Nov
NGK Insulators to expand capacity for chiplet ceramic support wafers that offer 5x warpage resistance
Japanese ceramics firm NGK Insulators has announced plans to triple its production capacity of support wafers by fiscal year 2027 (April 2027-March 2028). More specifically, these refer to double-sided polished alumina ceramic HICERAM Carriers used in chiplet packaging.