Apple and Google partnership on Gemini AI model signals major shift in Siri’s personalization and privacy approach
Research Insight: Qualcomm’s Ventana deal signals push to reduce Arm reliance and deepen RISC-V bets
MGC expands into AI liquid cooling market
Internal memo reveals Micron has locked in PSMC HBM capacity through prepayment
Powerchip Semiconductor Manufacturing Corporation (PSMC) has provided new details on its planned sale of the Tongluo P5 fabrication plant to Micron Technology, confirming that the transaction is paired with a broader cooperation framework that includes prepaid reservations for high-bandwidth memory (HBM) back-end wafer manufacturing capacity.
TSMC speeds up US expansion while keeping FX strategy simple
NIAR launches chip-level advanced packaging platform to boost Taiwan’s semiconductor edge
Micron to buy PSMC Taiwan fab in $1.8bn deal as both recalibrate AI memory strategies
Micron Technology said it has signed an exclusive letter of intent to acquire Powerchip Semiconductor Manufacturing Corporation’s P5 fabrication site in Tongluo, Taiwan, in a cash transaction valued at US$1.8bn.
Amkor to close longstanding Japan chip plant as EV demand slows
Amkor Technology, the US-based semiconductor packaging and testing company, said it will close its Hakodate plant in northern Japan by December 2027, citing weak demand stemming from a slowdown in the global electric vehicle (EV) market. The factory, located in the town of Nanae in Hokkaido, specializes in packaging chips used in automobiles.