NAND makers hike prices up to 100%, squeezing low-end consumer drives
Render Network predicts fully brand-owned AI experiences and GPU-powered creation surge in 2026
Top 10 Chart: Taiwan’s IC design sector ends 2025 with an AI-led split
Micron’s new fabs target 2030 rollout as supply shortages linger
Micron is scheduled to begin construction on its planned New York state megafab site on January 16, 2026, advancing its US manufacturing expansion even as executives warn that new capacity will take years to meaningfully ease tight conditions in the global memory market.
Research Insight: System-level design, energy efficiency, and TCO drive AI hardware competition
TSMC sees memory price hikes unlikely to curb demand as Apple and Samsung adapt
Yageo secures full voting control of Shibaura Electronics after Tokyo delisting
Taiwan-based passive component maker Yageo said Japan’s Shibaura Electronics was officially delisted from the Tokyo Stock Exchange on January 13. Following the completion of the share consolidation, Yageo now holds 100% of the voting rights in Shibaura Electronics as of January 15.
Canon eyes 2027 inkjet wafer planarization launch
Canon said on January 13 that it has developed a new wafer planarization technology designed to uniformly smooth surface irregularities during semiconductor manufacturing. The process applies resin materials using inkjet printing and then presses a glass plate onto the surface, using a stamping-like method to achieve planarization.