Hanmi Semiconductor announced it will release a dedicated device called the “Wide TC Bonder” by the end of 2026, designed specifically for next-generation high-bandwidth memory (HBM). Industry sources expect this equipment to be officially adopted starting with the eighth-generation HBM5.
LG Electronics has once again taken center stage at CES, collecting a slew of CES 2026 Innovation Awards, including two prestigious Best of Innovation honors that highlight the company’s leadership in next-generation smart life solutions and cutting-edge display technology. The awards, presented by the Consumer Technology Association before CES, celebrate products and services that push design…
The LG 37G800A is a 37-inch VA curved UltraGear display that aims to merge immersive gaming performance with the color fidelity and workspace real estate that creators appreciate. Its 1000R curvature wraps the field of view to draw you into games and video while also helping reduce eye movement across wide timelines and multi-window layouts. The panel’s 4K UHD resolution preserves fine detail…
Leading electronics contract manufacturer Hon Hai Precision Industry (Foxconn) reported October 2025 revenue of NT$895.71 billion (US$28.99 billion), up 7% sequentially and 11.29% year over year, driven by the continued AI boom and peak season for smartphone shipments. The company’s cumulative revenue for January to October 2025 reached NT$6.39 trillion, marking a 15.55% increase compared to the NT$5.53 trillion in the same period of 2024.
End-market performance is expected to reflect improving demand for automotive chips in the second to third quarters of 2026. The optical industry has benefited significantly, with companies including CALIN, Asia Optical (AO), and Canon focusing on automotive lenses.
ASE has announced a significant upgrade to its in-house integrated design ecosystem (IDE) platform, introducing IDE 2.0, which features AI integration to speed up design iterations and optimize chip-package interaction (CPI) analysis. The improvement aims to enhance the deployment of AI and high-performance computing applications by shortening development timelines.