TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to use a new “round-to-square” architecture to break through cost and capacity bottlenecks in large AI chip packaging and build its next competitive moat.
Ability Opto-Electronics Technology, an optics maker, said on June 29 that its V-groove and mechanical transfer (MT) products for co-packaged optics (CPO) are likely to become its second-largest product line after notebook camera modules, as the company pushes to expand into new growth drivers. Chairman Weiya Gao said the expected 10% to 20% cut in 2026 shipments by notebook brands would have a relatively limited impact, since the company mainly supplies high-end business notebook cameras.
Asia Neo Tech has announced a 15-year technology licensing agreement with US-based Brooks Automation to cooperate on FOUP (front-opening unified pod) cleaning equipment and expand its reach into global markets. The two companies held a signing ceremony on June 30, 2026.
Walmart and Constellation Energy announced on June 23 that the retailer signed its first nuclear power purchase agreement, securing about 176 MW of zero-emission electricity from the Dresden Clean Energy Center in Illinois. The deal comprises two 15-year contracts that include 30 MW of new generation capacity and are scheduled to begin in 2029 and 2030.
Huawei’s OpenHarmony is becoming a key variable in China’s consumer humanoid robot race, pushing the sector beyond hardware demos toward connected use across smartphones, smart homes, and education devices.
Local opposition to AI data center development surged in 2026, driving more than 300 temporary and permanent bans or moratoriums across the US since 2023, according to The Information. The wave of restrictions was concentrated in the Midwest and South, with the vast majority enacted in 2026 as communities paused projects to reassess policy and negotiate benefits.
Fulltech Fiber Glass is raising prices for its glass fiber cloth lines amid higher raw material, energy, transportation, and manufacturing costs that are squeezing margins. The move underscores broader pressure across global electronics supply chains, where demand for advanced materials tied to AI servers, satellites, and high-speed networking continues to reshape pricing and capacity.
Memory price inflation has emerged as one of the biggest challenges facing the consumer electronics industry, with Apple, Microsoft, and Nintendo all having signaled product price increases as widening supply-demand gaps continue to drive up memory costs.
As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating its push into 2nm-and-below nodes as well as advanced packaging technologies such as CoWoS. Industry sources said the AI-driven investment wave is now spreading beyond foundries into the equipment, materials, factory engineering, and inspection supply chains.
Samsung Electro-Mechanics is in final-stage talks to supply multilayer ceramic capacitors (MLCCs) to a major US cloud provider for AI servers, while also expanding substrate production capacity and securing a separate silicon capacitor contract, according to Korean media reports and company statements.
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