The Supreme People’s Court in China rejected Infineon’s reconsideration request on June 12, 2026, upholding a Suzhou Intermediate People’s Court injunction that found Infineon had infringed two of InnoScience’s core GaN invention patents. The ruling bars the affected products from being sold, imported, or offered for sale in China, and awards InnoScience approximately NT$45 million (US$1.4 million) in damages.
Taiwanese companies sharply increased enterprise AI investment and adoption in 2026, yet critical gaps in technology architecture and measurable return on investment risk blunting business impact, according to Dun & Bradstreet’s latest Enterprise AI Maturity Index. The index surveyed more than 300 Taiwanese firms across 17 industries as part of a global study of over 10,000 C-level executives in 32 advanced countries, finding momentum rising in the second quarter of 2026 but persistent operational hurdles.
As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes for local production and service, faster ramps for AI chip capacity, and customer demands for supply chain resilience amid de-Americanization and de-Chinaization pressures.
European luxury automakers are pulling back from China’s plug-in hybrid vehicle (PHEV) market after Beijing tightened eligibility requirements for new-energy vehicle incentives starting in 2026. The policy raised the minimum all-electric range for tax incentives from 43 kilometers to 100 kilometers. The threshold sidelined many European PHEV models and prompted a shift in market strategy, according to executives and foreign media reports.
India sees rising global tech investment as Meta, Reliance and Anthropic deepen AI ties, while EV firms expand, Starlink faces delays, and semiconductor and tablet markets show steady structural growth.
LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand for substrates used in AI servers, 5G smartphones, and on-device AI chips. The expansion targets RF-SiP, FC-CSP, and FC-BGA substrates, as substrate suppliers adjust capacity plans to stronger demand from advanced mobile devices and AI infrastructure.
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