30
May
30
May
The MSI MPG OLED 322URDX36 is a 4K 360Hz QD-OLED monitor debuting at Computex 2026
30
May
Xpeng plays the long game: South Korea on hold, Europe in sight
Xpeng Motors, often described as “China’s Tesla,” is advancing on two very different international fronts — cautious and measured in South Korea, but increasingly strategic in Europe — while competing Chinese EV peers such as Zeekr accelerate their own overseas expansion.
30
May
AUO Micro LED CPO enters sampling stage
AUO’s entry into Micro LED co-packaged optics sampling could give the display maker a new growth path as it seeks to expand beyond panels. Chairman Paul Peng said the company is preparing optical communication modules as a future driver of revenue and profits.
30
May
Intel makes first major move into India’s semiconductor ecosystem with advanced glass substrate manufacturing MoU
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel’s first significant participation in India’s semiconductor manufacturing ecosystem beyond its existing design and technology operations.
30
May
AI server testing firm Wendell prepares IPO for high-power lab unit on surging rack equipment demand
Wendell Industrial Co. held its 2026 annual shareholders’ meeting on May 26, where chairman Kao Chih-hung said shareholders approved a proposal for its subsidiary, Wendell Electrical Testing, to apply for an IPO. The plan is expected to be carried out in the fourth quarter or in 2027.
30
May
Samsung, SK Hynix trail Micron as automotive memory demand rises
Samsung Electronics and SK Hynix dominate the global memory chip market, but their weaker position in automotive memory is drawing new scrutiny as AI data centers absorb more DRAM and NAND supply.
30
May
‘You’re so rich now’: Jensen Huang toasts Taiwan supply chain partners as Vera Rubin ramp begins
At the Nvidia AI Factory MGX Ecosystem Showcase in Taipei, Taiwan, on May 29, Nvidia CEO Jensen Huang said that to meet the strong demand and support the production ramp for the next-generation Vera Rubin architecture, the company will double its artificial intelligence (AI) supercomputer capacity in Taiwan in 2026. He also thanked supply chain partners, saying he could not do it alone.
30
May
Pegatron Chairman says Taiwan’s AI rally has not yet peaked
As Taiwan’s equity markets continue to surge on enthusiasm surrounding artificial intelligence (AI), concerns about a potential AI-driven bubble have grown louder among investors and analysts.
30
May
Terafab explained: SpaceX outlines space-optimized chips and AI megafab plan in IPO filing
SpaceX’s IPO prospectus details an early-stage “Terafab” initiative to build large-scale AI chip manufacturing capacity. Still, the company warns of significant execution uncertainty, unfinalized partnerships, and capital intensity risks. The plan, still in preliminary form, depends on future agreements and could face delays, cost overruns, and supply-chain constraints.