BOE, China’s leading display panel maker, is accelerating its move into next-generation packaging technologies for the AI era. The company recently disclosed that it has formed a dedicated project team for Micro LED optical interconnect systems and glass substrate-based co-packaged optics (CPO), working with ecosystem partners on early-stage technology research to advance optical interconnect and glass substrate CPO development.

Global server demand is expected to stay strong through 2027, with implications for cloud operators, hardware makers, and data center customers worldwide. Large-scale buildouts, rising AI deployments, and high-performance computing demand are keeping supply chains tight, lifting prices, extending lead times, and raising the risk of fresh bottlenecks.