SK Hynix reportedly readies HBM4E samples for Nvidia as Samsung pulls ahead

SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market. According to Newsis, industry sources reported that SK Hynix had recently made positive progress in HBM4E development and was preparing to send samples soon, with shipments possibly beginning in June 2026 and no later than July 2026.

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Interview: From language to motion— Japanese startup APTO builds the data backbone for physical AI

Physical AI is emerging as a new frontier of model development. Any model, however, is only as good as the data used to train it. Because of this, Japanese startup APTO is launching a physical AI infrastructure lab to help plug the data gap needed to create vision-language-action (VLA) models, with a focus on imitation learning.

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SAP says human-in-the-loop review is key to moving enterprise AI agents from POC to production

SAP reported that enterprise AI agents are shifting from proof of concept to real-world deployment as companies aim to embed generative AI into operational workflows such as finance and supply chain management rather than limiting it to chat and summarization tools. The firm said many AI applications reached about 80% accuracy during the proof of concept stage, but that core workflows require substantially higher reliability and human oversight to ensure safety and compliance.

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NPAQ pivots to AI infrastructure and satellite NTN amid memory market slump

INPAQ Technology, a unit of PSA Walsin Technology, reported that revenue and profit in the first quarter of 2026 fell year on year, citing a supply-demand imbalance in the memory market and sharp raw material price increases. The company said it expected a gradual recovery in the second half of 2026 as industry inventories normalized and new products and customers began contributing. INPAQ also outlined a strategic shift to deepen its antenna businesses and expand passive components for AI servers and high-performance computing.

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