Goertek has begun mass production at China’s first 12-inch AR optical wafer fab, a milestone that could cut waveguide costs, strengthen the domestic AI smart glasses supply chain and speed up mass-market adoption.

Foxconn Interconnect Technology (FIT) unveiled its global automotive platform brand One Mobility at The smarter E Europe 2026, the continent’s largest energy industry trade alliance, marking FIT’s first appearance under the new brand and its third consecutive year at the event. The company said the rebrand consolidated its vehicle charging businesses under a single identity to boost market recognition and address rising competition in the electric vehicle charging infrastructure market.

Taiwan’s semiconductor ecosystem has entered the race to develop a possible post-HBM memory architecture, with Powerchip Semiconductor Manufacturing Corp. (PSMC) and AP Memory appearing alongside Intel and SoftBank subsidiary SAIMEMORY in a nine-layer 3D high-bandwidth DRAM demonstration.