TSMC CoWoS output reportedly to reach at least 200K wafers in 2027
TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly output will reach at least 200,000 wafers in 2027. Equipment makers are still waiting for TSMC to finalize order allocation, a delay that is raising fears of price-cutting competition and delivery delays, as lead times run at least seven to nine months.
Google Cloud says Taiwan’s AI shift to production could shape global enterprise use
Z.ai widens lead over MiniMax: China’s AI model race shifts from scale to staying power
China’s AI model race is moving beyond parameter size, benchmark rankings and user buzz. Investors are now asking which companies can turn model spending into durable revenue, pricing power and enterprise workflows.
Kioxia, SanDisk ship BiCS10 samples as NAND comeback takes shape
TSMC, ASML, and Imec target 2D chip mass production in Taiwan within five years
ASML, Imec and TSMC are collaborating in southern Taiwan to develop manufacturing equipment for two-dimensional (2D) semiconductor materials, marking a significant step toward commercializing technologies widely viewed as essential for extending Moore’s Law beyond the limits of conventional silicon scaling.
Taiwan just built its own robot dog — its first mission: fighting fires
It walks, it climbs, it reads gauges — and it’s 100% homegrown. Taiwan’s first domestically developed quadruped robot dog platform officially debuted on July 8, after the Industrial Technology Research Institute (ITRI) spent more than a year working with local academia and industry to complete two prototype models.
Former chip designer turned VC delivers reality check on AI, CPO hype
LG Innotek expands Vietnam footprint with new IC substrate plant
Mistral Robotics model puts France’s industrial AI push in focus
Mistral AI has introduced its first robotics navigation model, extending the French AI startup’s push into physical AI and industrial automation.