Foxconn, Intel link chips, racks and systems in AI infrastructure push

Foxconn announced on June 4 a strategic partnership with Intel to explore end-to-end AI solutions spanning chips, racks, systems, and applications, with cooperation covering AI rack infrastructure, edge AI, and physical AI platforms. The partnership will also extend to design services for custom ASICs, SoCs, and system integration, combining Intel’s processor, silicon photonics, and software ecosystem with Foxconn’s global manufacturing scale, system integration capabilities, and AI data center deployment experience.

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AI energy demand drives a shift to vertical power delivery and smaller modules

As the global demand for AI accelerates, a new industrial challenge has emerged: the sheer scale of energy required to power the “AI factories” of the future. This concern was the centerpiece of presentations by several industry figures at Computex in Taipei, where they presented solutions under development, from raw material innovations to shrinking component sizes.

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Local Chinese brands challenge dominant brands in AI glasses innovation; limitations hinder mass adoption

This year’s Global Connect Show (GSC) in Shenzhen, China, has become a medium for local tech brands to showcase AI wearable innovation. Two leading brands at GCS, Rokid and INMO, demoed their feature-packed AI glasses. Many companies featured AI translation as their flagship capability, paired with lightweight hardware, hands-free controls, customizable designs, and flexible model support. While on-site demos proved these up-and-coming brands’ AI glasses may outperform dominant players such as Meta and Apple, there are still lingering flaws, such as battery life and privacy ethics, that stand in the way of mainstream mass adoption.

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