TSMC’s 20-year advanced packaging strategy secures Apple and Nvidia ties

TSMC has solidified its critical role in the global semiconductor supply chain through nearly two decades of strategic investment in advanced packaging, positioning itself at the forefront of the AI era. Shang-Yi Chiang, a key figure dubbed one of the “Six Knights of TSMC R&D,” reflected on how the company laid the groundwork early for AI-driven growth by pioneering CoWoS and InFO technologies.

Continue reading

The Dell P2726DEB and Dell P2726DEB debuts with 100Hz QHD displays and 4-star Eye Comfort 3.0 rating

The Dell P2726DEB and the Dell P2726DEV constitute the second pair of 2026 Dell Pro P monitors, targeting modern hybrid‑work environments, combining high‑resolution panels, advanced webcams, extensive connectivity, and strong ergonomics. The two monitors share the same 27‑inch IPS display panel with a 2560 x 1440 resolution, 350‑nit brightness, 1500:1 contrast, and 120Hz refresh rate. Their matte…

Continue reading

The Dell P3426WEB and Dell P3426WEV are here with 100Hz ultra-wide curved IPS displays

The last pair of 2026 Dell Pro P monitors comprises two ultra-wide curved models – the Dell P3426WEB and the Dell P3426WEV. Again, the difference between the two is in the audio department. The P3426WEB boasts two 5W speakers and two microphones, while the P3426WEV lacks those. The webcam is exactly the same unit installed on the 23.8-inch and the 27-inch models – with a QHD resolution, an f/3.4…

Continue reading

The Dell P2426HEB and Dell P2426HEV is the first pair from the 2026 Dell Pro P series of monitors

Dell has released the first monitors from its updated 2026 Dell Pro P series. The first pair includes the Dell P2426HEB and Dell P2426HEV – two nearly identical models aimed at productivity‑focused users. The two monitors feature the same 23.8-inch IPS panels with an FHD resolution, a 120 Hz refresh rate, 300‑nit brightness, and a 1500:1 static contrast ratio, positioning them as reliable options…

Continue reading

Hanmi Semiconductor strengthens ties with India amid Micron facility launch

South Korean thermal compression bonder leader Hanmi Semiconductor has announced the development of the industry’s first dual-function BOC COB Bonder, capable of performing both Board-on-Chip (BOC) and Chip-on-Board (COB) processes within a single system, according to Yonhap News Agency and Maeil Business Newspaper. The company says the equipment is designed to improve process flexibility and production efficiency for high-performance memory products.

Continue reading

Japanese-led price surge in inductors could reshape mid-to-high-end passive components market and shift share to Taiwanese suppliers

Global passive components suppliers are entering a new price-hike cycle in 2026 as Murata Manufacturing and TDK Corporation prepare steep increases for inductors, with reported single increases exceeding 100% that will also affect ferrite beads and high-frequency inductors. The move is drawing attention across the supply chain.

Continue reading

Egis showcases satellite and drone integration at MWC 2026

Egis Technology and its subsidiaries are jointly exhibiting at the 2026 Mobile World Congress (MWC 2026). Centered on integrated terrestrial and space connectivity, physical AI, and low-power intelligent computing, the group is highlighting its comprehensive capabilities in satellite IoT, edge AI visual perception, drone system integration, ultra-low latency wireless transmission, and ultra-low power AI chips.

Continue reading