19
Mar
19
Mar
BYD slides as foreign automakers reclaim ground in China
China’s auto market is undergoing a sharp realignment in early 2026, as the phaseout of government subsidies exposes deeper competitive strengths — and weaknesses — among the industry’s leading players.
19
Mar
Nvidia adopts Groq to tackle AI inference and expand global reach
At its annual GTC conference in San Jose, Nvidia unveiled a major shift in its AI hardware strategy: integrating technology from AI chip startup Groq to address growing demand in AI inference, while simultaneously preparing new products for global markets, including China.
19
Mar
China’s mature-node push gathers pace: Nexchip, Silan, Hua Hong step up capacity and integration
China’s semiconductor strategy is shifting from leading-edge competition to strengthening mature and specialty nodes. Facing geopolitical pressure and supply chain fragmentation, domestic foundries are accelerating investment in 28nm-class technologies, analog chips, and vertically integrated ecosystems.
19
Mar
Analysis: China’s on-device AI chipmakers rush to supply OpenClaw, race for edge AI silicon leadership
OpenClaw is forcing a rethink of the AI hardware stack, shifting the locus of deployment from cloud-based interaction to autonomous, always-on agents running locally on devices.
19
Mar
Samsung reportedly broadens emergency management as chipflation takes off
Samsung Electronics has reportedly expanded emergency management measures across several key business units as rising semiconductor prices and component costs pressure profitability, according to South Korean media reports.
19
Mar
Hormuz blockade triggers domino effect across semiconductor supply chain
Iran’s blockade of the Strait of Hormuz has escalated from a regional shipping disruption into a systemic threat to the global semiconductor industry. Initial market fears centered on crude oil prices — but the real damage is upstream, in the chemical precursors that underpin advanced lithography.
19
Mar
Samsung strike vote nears, DS and DX divisions clash over bonuses
As Samsung Electronics’ union members vote on whether to strike, market attention is shifting from the labor negotiations themselves to the disparities in benefits and potential conflicts of interest between the company’s two core business groups: Device Solutions (DS) and Device Experience (DX).
19
Mar
SK Hynix presses ahead on HBM4 despite tightening AI memory supply
SK Hynix is accelerating its next-generation memory strategy, with stable progress on HBM4 production, aggressive capacity expansion in South Korea, and a growing focus on AI-driven demand expected to reshape the global memory market through the end of the decade. Citing Mirae Asset Securities, reports indicate that SK Hynix’s HBM4 development and mass production timeline is on track, with no significant delays or quality issues observed. The company is expected to align production with major GPU customer roadmaps, and most of its 2026 HBM capacity has already been secured by key clients, reducing near-term uncertainty.
19
Mar
Rapidus scales back US 2nm R&D early, raising timeline and funding concerns
With support from the Japanese government, Rapidus has been advancing R&D and pilot production testing to mass-produce 2nm chips by 2027. However, due to funding constraints and schedule pressure, Rapidus has begun scaling back its R&D investment at NY Creates in New York earlier than expected — a move that could negatively impact its mid- to long-term development of advanced process technologies at the 2nm node.