Japan is accelerating efforts to build domestic AI capabilities, with SoftBank and major industrial partners forming a new company focused on physical AI to power robots, vehicles, and factory systems. Referred to as the Japan AI Foundation Model Development, the new venture was established by SoftBank, NEC, Honda Motor, and Sony Group, each holding stakes of more than 10%, according to Nikkei Asia and TechWire Asia. Additional investors include Nippon Steel, Kobe Steel, and major Japanese banks such as MUFG, Sumitomo Mitsui, and Mizuho, reflecting broad backing from Japan’s industrial and financial sectors.

To strengthen communications resilience, Taiwan’s Ministry of Digital Affairs (MODA) is promoting a high-altitude platform station (HAPS) project. The initiative uses domestically produced drones as carriers integrated with communication systems to create an aerial communications platform featuring long endurance and high payload capacity. The program aims to begin testing with telecommunications operators in the third quarter of 2026, with plans to publicly showcase its achievements in October.

As AI chips demand higher performance and denser integration, advanced packaging and substrate technologies have become critical in the semiconductor race. Samsung Electro-Mechanics (Semco) is reportedly establishing a new production line for multilayer ceramic capacitor (MLCC) embedded semiconductor substrates at its Vietnam facility to strengthen its position in the AI semiconductor supply chain.