2026 Hisense U6SF Pro ULED Mini LED 4K Fire TV series specifications and features

The 2026 Hisense U6SF Pro series was formally announced on March 9. However, Hisense unveiled its full specifications and features this past weekend. The Hisense U6SF (QD8SF) series comprises five models: Hisense 100U6SF Pro – specifications Hisense 85U76SF Pro – specifications Hisense 75U6SF Pro – specifications Hisense 65U6SF Pro – specifications Hisense 55U6SF Pro – specifications The Hisense…

Continue reading

2026 Hisense U6SF (QD8SF) ULED Mini LED 4K Fire TV series specifications and features

The 2026 Hisense U6SF (QD8SF) series was announced together with the U6SF Pro series on March 9. It is now completely unveiled in the U.S. as the U6SF and in Canada as the QD8SF series. The Hisense U6SF (QD8SF) series comprises six models: Hisense 100U6SF (100QD8SF) – specifications Hisense 85U76SF (85QD8SF) – specifications Hisense 75U6SF (75QD8SF) – specifications Hisense 65U6SF (65QD8SF)…

Continue reading

Advanced Echem expands DUV, packaging, and optical materials to serve global chip progress

Advanced Echem Materials’ (AEMC’s) expansion in DUV photoresists, advanced packaging, and optical materials signals increased global supply capacity for cutting‑edge semiconductor processes, potentially easing material constraints and supporting fabs moving beyond 3nm. The company’s R&D growth and factory plans aim to meet rising demand from global chipmakers and device makers.

Continue reading

Explainer: Why Nvidia’s Groq LPU runs on Samsung silicon— Groq’s scale and inference strategy

Nvidia CEO Jensen Huang highlighted at GTC 2026 that AI has shifted from early model training to an era defined by inference and agent computing. To meet growing inference demands, Nvidia integrated its strategic acquisition of Groq and launched the Groq 3 LPU Rack as a token accelerator designed for ultra-low latency inference tasks, with Huang announcing that the LPU chip is manufactured by Samsung Electronics.

Continue reading