Samsung Electro-Mechanics reportedly to expand AI packaging with MLCC embedded substrate line in Vietnam

As AI chips demand higher performance and denser integration, advanced packaging and substrate technologies have become critical in the semiconductor race. Samsung Electro-Mechanics (Semco) is reportedly establishing a new production line for multilayer ceramic capacitor (MLCC) embedded semiconductor substrates at its Vietnam facility to strengthen its position in the AI semiconductor supply chain.

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Sovereign AI drives CSPs and telcos toward decentralized architectures for monetization

At the recently concluded GITEX AI Asia conference, executives from Nokia, AI chip innovator Blaize, and Indonesian telecom provider Datacomm discussed the evolution of AI infrastructure. In an exclusive interview with DIGITIMES, they highlighted that while training remains centralized in low-cost remote locations, inference architectures are rapidly shifting toward edge decentralization to enhance response times and data sovereignty.

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