AOC U27G4D goes official with a 165Hz 4K QD-OLED Penta Tandem display

The AOC U27G4D is the latest addition to AOC’s lineup of QD-OLED gaming monitors. It is built around a 26.5-inch 4K display, employing Samsung’s QD-OLED Penta Tandem with 4th Gen QD-OLED and EL Gen 3 technology. Brightness output scales with HDR window size: 250 nits typical in SDR at full‑screen APL, 450 nits typical at 10% HDR APL, and up to 1000 nits typical at 3% HDR APL. The monitor carries…

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The MSI MPG OLED 322URDX36 is a 4K 360Hz QD-OLED monitor debuting at Computex 2026

The MSI MPG OLED 322URDX36 debuts at COMPUTEX 2026, introducing what the company calls the world’s first triple‑mode QD‑OLED gaming monitor. Positioned as the flagship of MSI’s latest QD‑OLED lineup, the 31.5‑inch display arrives with a redesigned exterior and a suite of next‑generation technologies aimed at competitive gamers and high‑end PC enthusiasts. The headline feature is Triple Mode, a…

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Intel makes first major move into India’s semiconductor ecosystem with advanced glass substrate manufacturing MoU

India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel’s first significant participation in India’s semiconductor manufacturing ecosystem beyond its existing design and technology operations.

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‘You’re so rich now’: Jensen Huang toasts Taiwan supply chain partners as Vera Rubin ramp begins

At the Nvidia AI Factory MGX Ecosystem Showcase in Taipei, Taiwan, on May 29, Nvidia CEO Jensen Huang said that to meet the strong demand and support the production ramp for the next-generation Vera Rubin architecture, the company will double its artificial intelligence (AI) supercomputer capacity in Taiwan in 2026. He also thanked supply chain partners, saying he could not do it alone.

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Terafab explained: SpaceX outlines space-optimized chips and AI megafab plan in IPO filing

SpaceX’s IPO prospectus details an early-stage “Terafab” initiative to build large-scale AI chip manufacturing capacity. Still, the company warns of significant execution uncertainty, unfinalized partnerships, and capital intensity risks. The plan, still in preliminary form, depends on future agreements and could face delays, cost overruns, and supply-chain constraints.

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