Apple taps duo behind Apple Silicon success to navigate software-hardware balance in AI era
Apple said on April 20 that Tim Cook would step down as CEO and hand over the role to John Ternus, the company’s senior vice president of hardware engineering, on September 1, 2026. Ternus, who currently oversees the development of the iPhone, iPad, Mac, Apple Watch, AirPods, and the Vision Pro headset, will take charge at a pivotal moment, as Apple navigates intensifying competition in AI and rethinks the balance between hardware and software in its products.
Enflame tests IPO path with fast growth, Tencent reliance, and rising losses
IX Renewables urges Taiwan collaboration to advance floating wind power
Commentary: Honor’s smartphone engineering enters robotics, testing Unitree’s lead
At a humanoid robot half-marathon in the Beijing Economic-Technological Development Area (BDA or E-Town), Honor swept the top three positions with its in-house robot “Lightning,” placing six units in the top ranks.
MacBook Neo demand surge highlights chip shortage pressure
Samsung plans NAND expansion at P5 on AI-driven price gains
BYD reassesses Malaysia factory project as talks stall with the government
In August 2025, the Chinese electric vehicle (EV) maker BYD announced plans to build a completely knocked-down (CKD) assembly plant at the KLK Technology Park in Tanjung Malim, Malaysia’s Perak state, with operations expected to begin in 2026.
AP Memory posts 112% profit surge in March, expects stronger growth momentum in 2026
Beijing acts on memory price surge, AI demand reshapes device costs
China’s Ministry of Industry and Information Technology (MIIT) is stepping in to steady the memory supply chain after a sharp rise in DRAM and mobile memory prices began feeding into smartphones and other consumer electronics.