ViewSonic VX27G60Z-2K-5 is here with a 500Hz 26.5-inch QD-OLED panel
Wafer Works unveils golden triangle expansion to boost AI, optical, and SiC wafer capacity
AI power systems drive snap-in capacitor demand; Chinsan gains from order spillover
Demand in the passive component market has rebounded alongside the rapid buildout of AI data centers. While Japanese suppliers continue to lead in technology, their capacity expansion has struggled to keep pace with AI-related demand, driving order spillover to Taiwan-based manufacturers.
High-end fiberglass cloth supply tightens; shortages to persist through 2027
Demand for high-end fiberglass cloth is surging on the AI boom, and orders from copper-clad laminate (CCL) customers are leaving the world’s two largest suppliers, Nittobo and Taiwan Glass, short of capacity. In particular, low coefficient of thermal expansion (CTE) and low Dk2 products remain the tightest, with supply-demand gaps now expected to last through 2027.
Commentary: Google defines AI path to ASI, validates chip boom
TECO, Billion Watts and Tun Green Power form JV to develop Australia solar and storage projects
Japan puts robotics at heart of US$2.3 trillion chip revival
Japan is preparing a sweeping public-private investment strategy totaling more than JPY370 trillion (US$2.3 trillion) by fiscal 2040, spanning 17 strategic sectors including AI, semiconductors, aerospace, and energy-related industries.
LG Group execs visit Nvidia to expand physical AI and robotics ties
LG Group dispatched senior executives to Nvidia’s headquarters in Santa Clara, California, on June 22, 2026, to negotiate expanded cooperation in physical AI and robotics, following a leadership meeting between the two companies in Seoul on June 8, 2026. The delegation comprised more than 30 people from LG affiliates to explore commercialization opportunities, priority projects, and a partnership model that integrates the group’s core capabilities.