Nan Ya PCB to ramp up capacity as AI chips drive demand for advanced substrates
Nan Ya PCB, one of Taiwan’s leading IC substrate manufacturers, said it expects capital spending to rebound sharply in 2026, potentially reaching a record high, as demand from advanced chip packaging customers accelerates alongside the rapid growth of artificial intelligence (AI) computing.
Hyundai and Kia to launch South Korea’s first large-scale autonomous driving pilot
Pixio PX27UM is launched with a dual-mode 4K Fast IPS Mini LED display
The MSI MAG OLED 271QPX32 with a QD‑OLED Penta‑Tandem display will debut at Computex 2026
Ilitek eyes 2Q26 ramp for OLED TDDI and auto products
TSMC CoWoS yields top 98% as capacity expands
Samsung’s race to avoid a chip strike is running out of time
Samsung Electronics’ labor dispute entered a new phase on May 15 after the company’s top executives issued a rare public apology and proposed resuming talks without conditions, only for the union to maintain its plan for an 18-day strike from May 21 to June 7.
India roundup: India’s semiconductor ambitions expand from AI power management to supply-chain localization
India’s semiconductor and electronics sectors are accelerating across multiple fronts, from AI-driven power-chip development and domestic EV battery technology to smartphone manufacturing and semiconductor supply-chain expansion. Industry executives and analysts say the shift reflects India’s broader effort to move beyond assembly into higher-value chip design, power electronics, and localized technology ecosystems.