Intel’s Rio Rancho fab becomes test case for AI-era chip packaging
Samsung’s P4 HBM push could worsen DRAM crunch in 2027
Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth memory (HBM) in 2027, a move that could tighten the supply of general-purpose DRAM as memory makers shift more production toward higher-value AI server products.
Samsung’s silicon photonics push adds new layer to Korea-Dutch chip ties
South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML’s EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers.
Kioxia targets 2027 BiCS 10 NAND production as Samsung, SK Hynix hold back investment
Japan’s carmakers stopped fighting Chinese EVs — and started copying them
Analysis: Nvidia’s Vera CPU opens new front in data center chip race
Nvidia CEO Jensen Huang is pushing the company deeper into the CPU market, betting that the rise of agentic AI will create a new growth engine beyond the GPUs that made Nvidia the dominant supplier of AI computing hardware.