24 Apr
Latest News and Trends

2026 Samsung S90H and Samsung S85H OLED TVs specifications and prices for Europe

The 2026 Samsung S90H and Samsung S85H OLED TVs are gradually launching in Europe and the UK. The two series share a design philosophy but target different tiers of performance and below we list each model with its respective specifications and price. Samsung QE83S90H – specifications; EUR 7199 Samsung QE77S90H – specifications; EUR 4599 Samsung QE65S90H – specifications; EUR 3199 Samsung…

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24 Apr
Latest News and Trends

2026 Samsung QN990H launched with advanced AI features and advanced Quantum Mini LED Pro tech

The 85″ Samsung QN990H is the only 8K offering by the brand for this model year (so far). This is a flagship Neo QLED 8K TV that introduces a new generation of AI‑driven picture processing, Mini LED precision, and an immersive design that pushes the boundaries of premium home entertainment. The European model is dubbed Samsung QE85QN990H and costs EUR 9999 / CHF 8999. It remains unknown whether…

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24 Apr
Latest News and Trends

Google splits AI chips into training and inference TPUs, signaling shift toward workload-specialized AI infrastructure

At Google Cloud Next 26, Google Cloud announced a strategic shift in its AI hardware approach by introducing two distinct eighth-generation Tensor Processing Units: the TPU v8t for training and the TPU v8i for inference. The move is intended to boost performance and energy efficiency by optimizing each chip for its specific role.

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24 Apr
Latest News and Trends

Chipmakers face higher cost pressure as packaging outpaces foundry price hikes

In recent weeks, chip companies ranging from major players to small and medium-sized firms have issued price increase notices or begun renegotiating product prices with select customers. These moves aim to pass on steadily rising manufacturing costs across the supply chain as outsourced semiconductor assembly and test (OSAT) costs surge faster than even foundry price increases.

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24 Apr
Latest News and Trends

TSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker

The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC’s chip-on-wafer-on-substrate (CoWoS) and chip-on-panel-on-substrate (CoPoS) advanced packaging equipment orders. Industry sources indicate that ASE Technology Holding’s equipment orders may also be affected as the supply chain undergoes potential realignment.

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