In power electronics engineering, Silicon Carbide (SiC) companies are competing to achieve the absolute lowest thermal resistance (R_th), with the mindset that lower heat signature equates a superior system. However, at PCIM Europe 2026, a collaborative project between Rohm Semiconductor, Schweizer Electronic, and eMoveUs GmbH exposed a revolutionary counter-intuitive shift in design philosophy: willingly accepting a localized thermal performance deficit to ultimately achieve dominant system-level advantages.

Robotics has progressed rapidly in the past few years, but major obstacles — including data collection and trust infrastructure — remain barriers to widespread deployment. This was the takeaway from a recent panel of robotics experts at SuperAI Singapore, where they discussed the present and future of the industry.

Micro-Star International (MSI) said its gross margin recovered to 15% in the first quarter of 2026, after tariff costs, foreign exchange swings, and memory price surges weighed on profitability last year. Inventory clearing and more stable end-product pricing supported the rebound.