Optical communications maker PCL Technologies is expanding into high-power laser packaging, with its new Malaysia plant on track to pass customer certification by the end of 2026. Its earlier investment in US silicon photonics firm Skorpios and the acquisition of Pingood Enterprise also form part of the group’s co-packaged optics (CPO) strategy.

Samsung Electronics’ foundry business may return to profit as early as the third quarter of 2026, ahead of its previous target of late 2026 to 2027, as improving yields, larger orders, and stronger demand for high-bandwidth memory base dies lift utilization, according to Korean media reports.

SuperAlloy reported that rising demand from global luxury and supercar manufacturers, alongside green procurement policies, drove higher sales of recycled aluminum in May, lifting group momentum into the first half of 2026. The company said consolidated revenue for May reached NT$635 million (US$20.14 million) — up 6.7% from April and 18.74% from the same month in 2025. Cumulative consolidated revenue for January through May 2026 totaled NT$3.103 billion, up 2.86% year over year, returning the company to positive growth for the period.

TSMC’s AI capacity crunch is giving Intel its clearest opening in years to re-enter the most advanced chipmaking race, with Google and Nvidia exploring Intel as a potential backup manufacturing and packaging partner for next-generation AI processors.