Optical industry leaders Largan and Genius Electronic Optical (GSEO) have recently discussed progress in co-packaged optics (CPO), a key non-smartphone growth driver, and their strategies differ sharply. As customer demand and orders become clearer and more firmly secured, both companies have also turned markedly more confident, having taken a more cautious stance in prior quarters.
During a panel discussion between executives and research experts from Bosch, Infineon, Rohm Semiconductor, Nexperia, Wolfspeed, and Omdia at PCIM Europe 2026, one reality was made clear: frictionless, globalized chip manufacturing is ending. While the conversation reflected industry enthusiasm for new applications such as AI servers and industrial motor drives, it was tempered by macroeconomic realities of international trade protectionism, regional resilience mandates, and aggressive tariffs.
SK Hynix is reviewing rare price increase requests from several tier-one equipment suppliers, a sign that the high-bandwidth memory boom is beginning to reshape pricing power in South Korea’s semiconductor equipment supply chain.
India has expanded exemptions from mandatory quality certification requirements for imports by Special Economic Zone (SEZ) units and developers, a policy change that industry observers say could ease the establishment of semiconductor manufacturing facilities in the country.
Linkotech said its fan-out panel-level packaging rollout is showing early momentum, with certification from a North American low-Earth-orbit satellite communications customer and first equipment deliveries completed in the first half of 2026. The company said related sales could quickly rise to double digits as a share of annual revenue, with implications for supply chains worldwide.
Nvidia has begun telling Chinese clients that its new Vera central processing unit (CPU) could be available as soon as August and that they can start placing orders, Reuters reported, citing three people familiar with the matter.
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