The memory market is no longer just a component story — it is becoming a fault line running through the entire tech industry. As AI infrastructure buildout accelerates, cloud and data-center operators are consuming DRAM and NAND at a pace that is crowding out smartphone makers, distorting foundry economics, and forcing chipmakers to rethink how they secure supply. The consequences are rippling from factory floors in Asia to boardrooms in Silicon Valley.

TSMC is accelerating supplier upgrades and has made growing the share of Taiwan-sourced equipment components a long-term strategic objective. As of February 2026, it had worked with 12 suppliers across 22 continuous improvement processes (CIP) programs, halving validation and development timelines and generating NT$2 billion (US$63.7 million) in annual output value.

Telecommunications giant Ericsson has announced its participation at the 2026 Mobile World Congress (MWC), scheduled for March 2 to 5 in Barcelona, under the theme “Enter new horizons.” At the event, the Swedish company will collaborate with its global ecosystem partners to demonstrate how AI is driving the evolution of mobile networks and laying critical foundations for 6G.

NAND prices continue to climb, and supply remains tight. NAND controller supplier Phison Electronics has notified customers that it will revise payment terms. The company said rising NAND prices have sharply increased its funding requirements. To secure a more stable supply, it will discuss prepayment arrangements with customers on a case-by-case basis.