TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically demanding panel-level packaging technology CoPoS, aiming to widen its lead over rivals in the AI semiconductor race. Industry sources said TSMC has imposed strict confidentiality controls across the CoPoS supply chain, requiring Taiwan-based equipment and materials partners to sign agreements that prevent technology leakage and limit supply to TSMC for several years after mass production begins.

Nvidia and Corning are expanding their partnership in a move that underscores how the artificial intelligence infrastructure race is rapidly shifting beyond GPUs and into optical connectivity, photonics, and advanced manufacturing.

The Ministry of Economic Affairs (MOEA) announced on May 6 that, excluding TSMC, about 20 Taiwan companies plan to invest US$35 billion in the US. The statement comes after US President Donald Trump issued reciprocal tariffs in April 2025, which unexpectedly helped speed up long-stalled progress on a Taiwan-US economic and trade agreement.