China and the Netherlands agreed that their governments should create a favorable environment for companies to resolve the Nexperia dispute through consultation, China’s Ministry of Commerce said July 16.
Micron has said its Strategic Customer Agreement (SCA) long-term supply deals with 16 key strategic customers include seven automotive customers — among them Qualcomm, Visteon, and Harman, all key suppliers supporting the automotive ecosystem — reinforcing its push into the auto supply chain. The memory maker said the agreements also cover CSPs and AI infrastructure players.
The surge in AI and high-performance computing (HPC) technologies continues to reshape the semiconductor landscape, as demonstrated by the June 2026 financial performances of key supply chain players in Taiwan. Within this thriving ecosystem, IC testing and design services have emerged as pivotal backbones ensuring the physical viability and operational efficiency of next-generation silicon.
A Taiwan-Japan AI technology forum held at Taiwan Expo Japan brought together government, industry, academia and research representatives to discuss AI applications, semiconductor supply chains, smart manufacturing and innovation. Terry Tsao, SEMI’s global marketing chief and head of the organization’s operations in Taiwan, told DIGITIMES before the event that IBM has already demonstrated 2nm chip manufacturing capability in the lab, but the biggest challenge for its licensed partner, Japanese chipmaker Rapidus, to achieve mass production in Hokkaido will be yield.
OnePlus is exiting the North American and European markets for its future product launches, while sales of new Realme products will be suspended within its home market of China. The changes to both Oppo sub-brands signal the challenges low- to mid-tier brands face amid rising component costs and a tough global smartphone market this year.
China’s AI industry is shifting from model scale to the infrastructure needed to train, deploy and commercialize AI, with supernodes, high-speed interconnects, and computing efficiency dominating WAIC 2026.
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