Foxconn says its quantum computing unit aims for commercial takeoff around 2030

Foxconn has said its quantum computing work is drawing international attention, but the main challenge remains turning research into a commercial business. The company’s quantum efforts could take about three years to reach an inflection point, with broader business potential expected around 2030, which may matter for industries and researchers worldwide.

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Quanta projects strong 2026 AI demand as it expands server and wearable production

Quanta said demand for artificial intelligence (AI) infrastructure would be very strong in 2026 as the company pushed deeper into servers and wearable devices, and that it was expanding production in the US, Mexico, and Thailand. The remarks were made at the company’s shareholders’ meeting on May 29, where leadership framed AI as a major growth opportunity while reiterating a cautious approach that prioritizes profitable execution.

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CPO to become the next major growth driver, says GSEO; future volumes could rival smartphone lenses

Genius Electronic Optical (GSEO) held its shareholders meeting on May 29, with chairman Jones Chen and president Ying-Li Guo in attendance. GSEO reported standalone revenue of NT$20.89 billion (approx. US$665.7 million) in 2025, up 13% from NT$18.496 billion in 2024. Consolidated revenue reached NT$24.989 billion, increasing 8% from NT$23.187 billion in 2024. Earnings per share (EPS) came in at NT$32.84, slightly lower than the previous year’s NT$38.35.

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MediaTek weighs price hikes, reaffirms TSMC partnership

MediaTek held its shareholders’ meeting on May 29. Addressing the company’s future outlook, Chairman Ming-Kai Tsai said that while the mobile phone market in 2026 has performed below expectations due to a sharp rise in memory prices, MediaTek’s market share in various connectivity chips has increased significantly. He also noted that the company began generating revenue from AI data centers in 2026.

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Arm deepens ties with Taiwan chip designer QBit around edge AI and cybersecurity

Arm EVP and Chief Commercial Officer Will Abbey visited QBit Semiconductor’s Taiwan headquarters on May 27, signaling deeper cooperation that could shape future chip design for edge AI, physical AI, and quantum-computing cybersecurity. The visit highlights how platform alliances are increasingly influencing next-generation computing architectures for global technology markets.

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Compal accelerates server push with Texas plant and aims for 40% non-PC revenue

Compal Electronics said it was scaling up its server business and expects server revenue to reach 8-10% of total sales in 2026 as AI server rack-scale systems ramp and a new Texas plant begins operations in the second half. The company reported that server sales rose to 5% of revenue in the first quarter of 2026 from less than 1% previously, driven by a shift from printed circuit board (PCB) assembly to rack-level and full-system solutions that increase revenue per project.

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From cloud to factory floor: KETI outlines four directions shaping next-gen physical AI chips

As AI moves from cloud environments into factories and physical systems, semiconductor design is being reshaped by new demands in speed, energy efficiency, and on-site learning. At a recent system-semiconductor seminar in South Korea, Seong-jun Jang, a research center director at the Korea Electronics Technology Institute (KETI), outlined four key architectural directions for future AI chips aimed at supporting industrial “physical AI.”

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