22 May
Latest News and Trends

US-Japan cooperation could protect Taiwan ‘99%’, defense investors told at Silicon Valley summit

Taiwan’s semiconductor industry and the military implications of a potential cross-strait conflict dominated the aerospace and defense track on the second day of the Plug and Play Silicon Valley May Summit, as investors and defense technology executives described a geopolitical environment that is fundamentally reshaping where capital flows and why.

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22 May
Latest News and Trends

AMD deepens Taiwan supply chain ties with US$10B-plus push

AMD CEO Lisa Su arrived in Taiwan on May 20, 2026, on a private jet and largely followed the same itinerary as her April 2025 visit, including a meeting with TSMC, a technology forum and dinner with Taiwan supply chain partners, and an about one-hour summit forum. This time, AMD also made the rare announcement that it will invest more than US$10 billion in Taiwan’s industrial ecosystem to accelerate AI infrastructure buildout.

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22 May
Latest News and Trends

Innovation at the edge: Semiconductor startup highlights from Plug and Play Silicon Valley May Summit 2026

At the recent Plug and Play Silicon Valley May Summit, the semiconductor and supply chain sessions highlighted a critical shift toward hardware-level security, energy efficiency for AI, and AI-driven quality engineering. Startups, including Enclave Semiconductor, Bedrock Semiconductor, and Lattice, presented solutions aimed at securing and optimizing the global electronics ecosystem.

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22 May
Latest News and Trends

Nvidia characterizes LPX as niche silicon optimized for high-speed premium tokens

Nvidia has positioned its specialized LPX accelerator as a niche product designed specifically for low-latency, high-speed token generation rather than broad-market enterprise workloads. The hardware targets a narrow segment of service providers that operate premium, high-velocity token applications for select customer bases. While the architecture excels at rapid text decoding, its broader market adoption remains constrained by structural limitations in throughput and memory capacity.

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22 May
Latest News and Trends

Tech Forum 2026: AI agents drive Arm CPU demand surge; 2026 shipments expected to exceed 6 million units

On May 20, 2026, DIGITIMES held its Tech Forum, where senior analyst Jim Hsiao delivered a presentation, “AI server market outlook and trends amid the explosion of agent applications.” In it, Hsiao explained that demand is rising sharply not only for x86 server CPUs from Intel and AMD, but also for Arm-based CPUs, which are expected to see explosive growth in 2026.

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22 May
Latest News and Trends

Lam Research launches PLP Center of Excellence, replacing wafers with panels

Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology has drawn significant industry attention. Global semiconductor equipment manufacturer Lam Research announced the official establishment of its PLP Center of Excellence (CoE) in Salzburg, Austria, aimed at strengthening PLP process R&D capabilities and driving scalable manufacturing solutions to meet advanced packaging demands in the AI era.

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22 May
Latest News and Trends

AMD CEO meets with TSMC CEO in Taiwan as it expands US chip output

Advanced Micro Devices (AMD) CEO Lisa Su stated that the company plans to invest more than US$10 billion in Taiwan’s industrial ecosystem to accelerate the development of artificial intelligence (AI) infrastructure. The announcement was made during her visit to Taiwan, where she also disclosed the latest progress in collaborations with Taiwan Semiconductor Manufacturing Company (TSMC), backend packaging and testing, substrate, and AI server supply chains.

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