InnoScience wins China patent ruling, Infineon GaN sales banned

The Supreme People’s Court in China rejected Infineon’s reconsideration request on June 12, 2026, upholding a Suzhou Intermediate People’s Court injunction that found Infineon had infringed two of InnoScience’s core GaN invention patents. The ruling bars the affected products from being sold, imported, or offered for sale in China, and awards InnoScience approximately NT$45 million (US$1.4 million) in damages.

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Taiwan firms ramped AI investment but must fix architecture to realize ROI

Taiwanese companies sharply increased enterprise AI investment and adoption in 2026, yet critical gaps in technology architecture and measurable return on investment risk blunting business impact, according to Dun & Bradstreet’s latest Enterprise AI Maturity Index. The index surveyed more than 300 Taiwanese firms across 17 industries as part of a global study of over 10,000 C-level executives in 32 advanced countries, finding momentum rising in the second quarter of 2026 but persistent operational hurdles.

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Southeast Asia shifts from test-and-pack to multi-center advanced packaging hub

As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes for local production and service, faster ramps for AI chip capacity, and customer demands for supply chain resilience amid de-Americanization and de-Chinaization pressures.

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China’s new EV rules push European luxury PHEVs to the exit

European luxury automakers are pulling back from China’s plug-in hybrid vehicle (PHEV) market after Beijing tightened eligibility requirements for new-energy vehicle incentives starting in 2026. The policy raised the minimum all-electric range for tax incentives from 43 kilometers to 100 kilometers. The threshold sidelined many European PHEV models and prompted a shift in market strategy, according to executives and foreign media reports.

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Taiwan’s IC design sector posts sharpest gains in years; May data hints at further acceleration into 2H26

Taiwan’s fabless semiconductor design sector posted its strongest year-over-year growth figures in years as of May 2026, with a cluster of memory-adjacent and storage chip makers leading a recovery that is both remarkable in scale and strikingly uneven in distribution. Of the 105 companies tracked, 69 reported positive accumulated year-over-year growth through May, but the top performers are lapping the field by multiples, not percentages.

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SK Hynix to test ChatGPT and Copilot as Samsung widens enterprise AI use

SK Hynix said it is evaluating external generative AI models, including ChatGPT Enterprise and Microsoft Copilot, as it pilots broader AI use across the company, following Samsung Electronics’ recent rollout of external generative AI services for employees. The move was disclosed during an internal briefing on the semiconductor maker’s AI transformation plans and is aimed at extending AI from support tasks into decision-making, research and development, and wider operations.

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Exclusive: Wiwynn triples capital, president says it signals confidence

Wiwynn, Taiwan’s smallest-capital server ODM with the highest EPS, is set to triple its share capital after shareholders approve a retained-earnings-to-capital-increase plan in 2026. President William Lin said the move is meant to show the market that the company is optimistic about the future. Wiwynn’s capital will jump from NT$1.858 billion (approx. US$59 million) to NT$5.574 billion, a move that Lin said is rare among technology companies. He called the company “very bold,” adding, “This is also telling the market that we are very optimistic about the future.”

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LG Innotek’s Vietnam substrate investment plan comes as FC-BGA demand broadens

LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand for substrates used in AI servers, 5G smartphones, and on-device AI chips. The expansion targets RF-SiP, FC-CSP, and FC-BGA substrates, as substrate suppliers adjust capacity plans to stronger demand from advanced mobile devices and AI infrastructure.

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