禾臣新材完成过亿元B轮融资

据投资界10月29日消息,近日,安徽禾臣新材料有限公司(以下简称“禾臣新材”)完成过亿元B轮融资,由国泰君安创新投资与中车国创基金联合领投,金圆资本、派维投资等产业方共同投资,资金将主要用于8.6代空白掩模版(Blank Mask,光掩模版基板)与半导体先进制程抛光垫产能扩充,同时加大与战略客户研发配套投入,以满足市场需求。

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Texas Instruments sees 50% YoY data center growth amid signs of slower recovery

As US semiconductor companies race to expand domestic manufacturing capacity, Texas Instruments (TI) and Micron Technology are emerging as the most aggressive investors, committing tens of billions of dollars to new fabrication facilities. While Intel CEO Lip-Bu Tan’s “subtraction strategy” has steered the company back to revenue growth and profitability in the third quarter of 2025, continued construction delays at its long-promised Ohio plant mean that production remains a pipe dream. In contrast, Micron and TI are moving forward with massive investments in line with President Donald Trump’s “Made in the USA” initiative.

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Glass substrates edge toward prime time in PCB and chip packaging sector

As Moore’s Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of IC substrate technology and the global PCB landscape. Henry Utsunomiya, President of Fujitsu Interconnect Technologies (FICT) under Fujitsu Limited, noted that with heterogeneous integration now the dominant approach, the industry is undergoing a crucial shift from organic to inorganic substrates.

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