Hon Precision ramps AI GPU and ASIC testing equipment with orders through 1H26

Semiconductor IC testing equipment manufacturer Hon Precision has, in recent years, successfully entered high-power application markets such as AI, high-performance computing (HPC), and automotive chips through its ATC active temperature control systems, sorting machines, and high-parallel testing solutions. The company is expanding production capacity to meet growing demand from North American AI customers.

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Applied Digital secures US$15 billion lease to expand computing capacity at Polaris Forge 2 campus

Applied Digital, a firm specializing in data center design, development, and operations, has signed a US$15 billion infrastructure lease agreement spanning 15 years with an unnamed major US hyperscaler. The deal aims to add 200 MW of computing power at the company’s Polaris Forge 2 campus in North Dakota, increasing its total leased capacity at both Polaris Forge 1 and Polaris Forge 2 to 600 MW.

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India shifts electronics focus from assembly to component manufacturing

India’s electronics manufacturing industry is entering a new phase, moving beyond low-value assembly work toward domestic component production. Both government policies and corporate strategies now emphasize building a self-sufficient component ecosystem to reduce reliance on Chinese imports and strengthen India’s position in the global supply chain.

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UMT sees satellite order visibility improve, 4Q25 gross margin targets record high

High-frequency communication component manufacturer Universal Microwave Technology (UMT) has announced its operating results for the third quarter of 2025. The company reported NT$484 million (US$15.7 million) in revenue for the quarter and a net income of NT$88 million. The consolidated revenue for the first three quarters totaled NT$1.62 billion. Overall revenue has shown a steady month-by-month increase, indicating that the company has recovered from the early-quarter revenue dip caused by delayed shipments due to customer testing.

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Foxconn-backed Smart Mobility showcases homegrown EV charging management system at Riyadh Auto Show

Smart Mobility, a joint venture between Foxconn’s Foxconn Interconnect Technology (FIT) and Saudi Arabia’s Saleh Suleiman Alrajhi & Sons, recently unveiled its self-developed Charging Point Management System (CPMS) at the EV Auto Show Riyadh 2025. The system attracted significant attention at the exhibition, highlighting the company’s ambition to advance regional EV infrastructure.

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Cadence reports strong 3Q25 results as AI and HPC demand fuel growth

US electronic design automation (EDA) software company Cadence Design Systems posted third-quarter 2025 revenue of US$1.34 billion, up 10% from a year earlier and slightly above analysts’ consensus estimate of US$1.32 billion. The results underscore how surging demand for AI and high-performance computing (HPC) continues to drive the company’s core business.

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Memory shortage hits 70% order fulfillment; server DRAM prices surge 50%

The memory chip shortage has escalated into a severe crisis as upstream international manufacturers finalize contract prices for the fourth quarter of 2025. Intense competition for supply has driven the order fulfillment rate of major US and Chinese customers down to about 70%. Server DRAM contract prices have surged sharply by 40-50%, with capacity constraints also impacting lower-priority customers, whose fulfillment rates could drop below 40% over the next two quarters.

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Chunghwa Precision, Yokowo sign investment deal to deepen Taiwan-Japan testing industry ties

Taiwanese semiconductor test interface leader Chunghwa Precision Test Tech (CHPT) announced that it has signed an investment agreement with Japan’s Yokowo. Under the agreement, both parties will make equal equity investments of US$2 million each, aiming to strengthen collaboration in market access, customer relations, and product research and development, while jointly expanding business opportunities and enhancing product competitiveness.

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