TSMC pushes Japanese suppliers to localize electroplating additives in Taiwan
As AI-driven demand continues to lift global semiconductor output, TSMC is accelerating the localization of electroplating additives used in advanced packaging to secure a stable supply. Through four measures — production line guidance, equipment optimization, quality inspection, and sample validation — the company has supported Japanese suppliers in establishing production in Taiwan, cutting production cycles from 60 days to 20 days and improving logistics efficiency by 90%.