TSMC shareholders approved the company’s 2025 business report and financial statements at its 2026 annual shareholders’ meeting on June 4, giving investors a formal look at a year in which the world’s largest contract chipmaker converted the AI semiconductor boom into record-scale earnings.

Anduril Industries and Taiwan’s Metal Industries Research and Development Center signed a memorandum of understanding to deepen collaboration on unmanned aerial vehicle key technologies, executives announced during a recent visit that included a stop at Computex 2026. The agreement targets AI autonomous systems, drone manufacturing, supply-chain localization, and the construction of non-red supply chains to boost Taiwan’s international cooperation and global competitiveness in the drone sector.

Formosa Chemicals & Fibre Corp. announced plans to expand into high-value semiconductor and AI data center materials and will debut these businesses at COMPUTEX TAIPEI 2026. The company said it has shipped a high-RTI flame-retardant polycarbonate material for backup battery modules and cooling fans since 2025, is developing deep ultraviolet photoresist precursor materials, and is advancing a high-purity low-carbon hydrogen project to support semiconductor fabs.

SK Group chairman Chey Tae-won met TSMC chairman C.C. Wei in Taiwan on June 3, as SK Hynix and TSMC map out future cooperation in HBM4 base dies, advanced logic processes, and custom AI memory.