04
Jun
The race to build space-based internet networks is accelerating. But as thousands of low-Earth orbit satellites enter orbit, a more fundamental question is taking shape: who will control access to the customer?
04
Jun
Innodisk, Qualcomm and Formosa Plastics roll out GenAI-powered industrial safety vision
Innodisk announced a strategic partnership with Qualcomm and Formosa Plastics Group to launch an AI industrial safety vision solution that upgrades surveillance into intelligent video monitoring and decision-making tools. The collaboration combines Qualcomm Insight Platform AI imaging software, Innodisk’s edge AI servers and computing platforms, and Formosa Plastics’ field deployment and systems integration capabilities to deliver GenAI search and natural-language conversation features for industrial sites.
04
Jun
Taiwan courts the world’s AI startups in a bid to secure chip future
Taiwan is stepping up its efforts to position itself as a global hub for artificial intelligence and semiconductor innovation, deepening ties between international startups and its world-leading chip ecosystem.
04
Jun
Taiwan’s Walsin Technology gains pricing power from AI demand
Walsin Technology, one of Taiwan’s leading manufacturers of multilayer ceramic capacitors (MLCCs), has notified distributors that it will raise prices on resistors and selected capacitor products beginning June 1, citing mounting cost pressures and robust demand from AI-related applications. The move makes Walsin one of the first Taiwanese MLCC suppliers to formally implement a new round of price increases, and a sign that the inflationary effects of the artificial intelligence (AI) boom are spreading deeper into the electronics supply chain.
04
Jun
Interview: Andhra Pradesh moves to become India’s semiconductor packaging hub
Andhra Pradesh is making its most concrete move yet in semiconductors, zeroing in on packaging as the immediate entry point into the chip supply chain. Speaking on the sidelines of the Computex technology expo in Taipei, Bhaskar Katamneni, Secretary to the Government for ITE&C, acknowledged that wafer fabrication remains a long-term “seven or eight-year journey,” but said packaging work is already well underway — with four PCB manufacturers having already begun operations, according to him.
04
Jun
Huawei’s Tau Law exposes China’s EDA gap; Empyrean advances memory chip design tools
Huawei’s recently proposed Tau Law has drawn attention across the semiconductor industry, with the company arguing that chip performance can be improved by reducing the internal signal transmission time constant, known as τ, through multi-layer optimization across devices, circuits, architectures, systems, and algorithms.
04
Jun
E Ink and BMW advance automotive color-changing tech toward market readiness
Taiwan-based electronic paper leader E Ink Holdings is preparing to bring its color-changing vehicle technology to market after overcoming key regulatory and technical hurdles with BMW. The milestone marks a significant step in the company’s strategy to extend e-paper beyond displays and into vehicle exteriors, consumer products, and large-scale architectural surfaces.
03
Jun
Pegatron’s Chairman sees a future where AI can think and act
As the artificial intelligence industry moves beyond chatbots and text generation, a new question is emerging: what happens when AI can act on the physical world, not just understand it?
03
Jun
Liteon: RTX Spark could turn AI PCs into personal assistants
Liteon Technology showcased AI power management and liquid cooling solutions at COMPUTEX 2026, highlighting technologies aimed at supporting both AI PCs and next-generation AI data centers.
03
Jun
Micron’s HBM4 push signals bigger Nvidia supply role
Micron Technology may supply more HBM4 memory for Nvidia’s next-generation Vera Rubin platform than the market currently expects, as the US memory maker ramps up equipment investment for the new technology, according to sources in South Korea’s memory equipment industry.