Kunlunxin, the semiconductor subsidiary of Chinese search engine giant Baidu, is targeting a US$50 billion valuation for its Hong Kong public offering. The company is also asking investors to commit to buying its chips as a condition of participation, according to The Information, underscoring the competitive dynamics shaping chip makers as Beijing moves to strengthen its domestic AI supply chain.
ChangXin Memory Technologies has signed a long-term DRAM supply agreement with Tencent Holdings valued at more than CNY20 billion (approx. US$2.94 billion), three people with knowledge of the deal told Reuters, as the Hefei-based chipmaker prepares for one of China’s largest stock listings in years.
Samsung Electronics chairman Lee Jae-yong said Gwangju is being considered as a candidate site for Samsung’s next semiconductor complex, lending corporate backing to South Korea’s plan to build a second chip production base in Gwangju and the broader Jeolla region in the country’s southwest.
The US government’s move to add Chinese panel makers BOE and Tianma to a military-related list is raising concerns that Washington’s tech restrictions are spilling beyond semiconductors into the display supply chain. South Korean panel makers are now watching to see whether tighter curbs on China could create a new opening for them.
Taiwan’s first domestically built submarine, Haikun, has entered submergence testing and is on track to be handed over to the navy in the second half of 2026, state-owned shipbuilder CSBC Corp. Taiwan said at a shareholders’ meeting.
Taiwan’s Ministry of Economic Affairs has tasked Taiwan’s Industrial Technology Research Institute (ITRI) to set up the Quantum Industry Technology Promotion Office (QITPO) and has named dozens of companies as members of the quantum industry supply chain. To strengthen Taiwan’s quantum science and application base, the National Science and Technology Council (NSTC) has announced the launch of a quantum technology program, with the first 15 PhD-level candidates selected for overseas study.
Kyocera is committing JPY650 billion (approx. US$4 billion) to its components businesses through fiscal 2031, as AI data center investment and semiconductor equipment spending lift demand for ceramic parts, optical communication packages, and advanced semiconductor packaging materials.
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