This Taiwan company bets on acquisitions to chase Asia’s health e-commerce crown

Myson Century has added Winho Tech to its portfolio, coming hot on the heels of its acquisitions of Y-S Electronic and Great Computer Corporation (GCC). Going forward, Myson Century and Winho will collaborate on digital technology, enterprise network applications, and AI smart applications, integrating cross-platform resources at parent company Sun Yad Group to drive intelligent transformation across the corporate group.

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LG MAGNIT Active Micro LED – precision pixel control meets cinematic scale

LG has launched the LG MAGNIT Active Micro LED, a cutting-edge home cinema display that leverages Active Matrix technology for pixel-level precision. This next-gen screen delivers stunning clarity, contrast, and depth, elevating the premium viewing experience to new heights. Rolling out in Korea on October 21 and expanding to major markets like North America, the MAGNIT Active Micro LED joins…

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Chinese iPhone users take on Apple, accuse it of abusing market power for App Store

Fifty-five iPhone and iPad users in China have filed a joint complaint with the State Administration for Market Regulation (SAMR), accusing Apple of abusing its dominant position by requiring all app transactions to go through its official App Store. The complaint also challenges Apple’s mandatory in-app purchase (IAP) system, which imposes commissions of up to 30%, according to Reuters and Sina.

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Taiwan’s drone industry value doubles in two years

Chinese drone maker DJI had once dominated over 70% of the global consumer drone market and as much as 90% in the US. However, Taiwan’s domestic drone makers in recent years have begun to shine in the dual-use (civilian and military) market. The industry’s production value surpassed NT$5 billion (approx. US$163 million) in 2024 and is expected to exceed NT$10 billion in 2025.

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Global Electronics Association joins AMD and ASE to encourage advanced packaging standardization at IMPACT 2025

The Global Electronics Association (GEA) participated as a co-organizer in the 2025 International Microsystems, Packaging, Assembly, and Circuits Technology (IMPACT) Conference, hosting a special forum, “Component to System-Level Integration.” The session brought together leading companies, including AMD, ASE Group, Kinsus, and Wistron, to discuss the development and standardization needs of advanced packaging technologies in the AI era.

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