FOPLP and WMCM emerge as key to fan-out packaging competitive field

The advanced packaging market is entering a structural turning point. Among emerging technologies, fan-out packaging has hit a sweet spot between cost and performance, making it a key next-generation solution for applications such as AI mobile devices and high-performance computing (HPC). As a result, it has become a new battleground actively pursued by both foundries and OSAT providers.

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Advantech tops US$635 million in 1Q26 revenue on edge AI demand surge

Driven by accelerating real-world deployment of edge AI applications across major global markets, industrial PC (IPC) maker Advantech reported March 2026 consolidated revenue of NT$7.7 billion (approx. US$240 million), up 21.75% from NT$6.32 billion a year earlier. For the first three months of 2026, cumulative revenue reached NT$20.39 billion, marking a 17.49% increase from NT$17.35 billion in the same period of 2025.

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Wonderful Hi-Tech bets on AI servers and satellites for next growth wave

After a slower second half of 2025, marked by elevated customer inventories and a softer ordering pace, high-end cable material provider Wonderful Hi-Tech anticipates a rebound in 2026. According to the company, inventory adjustments are largely concluding in the first quarter, and customer orders and shipments have been steadily picking up since March, setting the stage for a quarter-by-quarter acceleration in revenue. The company aims to surpass its previously stated NT$10 billion (approx. US$313 million) revenue target, with Chairman Ming-Lieh Chang noting that current trends suggest actual results could exceed that benchmark.

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Rapid deployment and flexible scalability drive the rise of modular data centers

As GPU platforms continue to iterate each year, the buildout of AI infrastructure is accelerating in tandem. For data center operators, cloud service providers, hyperscalers, and large enterprises, the challenge is no longer just building the facility, but rather how to bring computing power online faster while preserving flexibility for future upgrades and expansion.

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China seeks break from Nvidia CUDA grip in AI chips

Generative AI is concentrating control of computing power within a narrow set of architectures and ecosystems. Wei Shaojun, chairman of the IC design branch of the China Semiconductor Industry Association and a professor at Tsinghua University, said AI competition now extends beyond hardware to control of rules and ecosystems, warning that continued reliance on existing systems could lock China into long-term dependence on critical technologies.

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