From components to systems: Ennostar to highlight optical comms, automation tech at Touch Taiwan

As the optoelectronics industry shifts from competition in individual components toward systems integration and higher value-added applications, optoelectronics solution provider Ennostar is focusing on two emerging sectors with long-term growth potential at the Touch Taiwan 2026 exhibition, running from April 8-10: optical communications and sensing, and automation. The company is also integrating its two core technologies of microLED and miniLED with automotive optoelectronics, presenting a comprehensive layout across four high-value application segments.

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MediaTek, Qualcomm reportedly cut smartphone AP orders with TSMC

Amid soaring memory prices, manufacturers have repeatedly lowered 2026 shipment targets for smartphones, PCs, and other consumer electronics, triggering a ripple effect across the supply chain. Recently, reports emerged that major Chinese smartphone brands are scaling back purchases of processors, forcing MediaTek and Qualcomm to reduce their subsequent orders with TSMC, with estimated cuts of 10-15% in wafer starts on 4/3nm processes.

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US PIPIR advances drone-missile strategy, integrating Taiwan into ‘non-China’ defense supply chains in Indo-Pacific

Amid sustained Middle East tensions, the US is redirecting strategic attention to the Indo-Pacific region, advancing a defense industrial network among first island chain partners. Through the Partnership for Indo-Pacific Industrial Resilience (PIPIR), Washington is spearheading a shift toward localized production and allied coordination to effectively decouple regional defense networks from Chinese supply chains.

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India roundup: India ramps up electronics and chip ambitions with new approvals, local fabs, and supply chain curbs

India is accelerating its push to build a self-reliant electronics and semiconductor ecosystem, approving new component projects, supporting local display and chip manufacturing, and tightening market access for Chinese products, as rising investments, policy incentives, and global partnerships position the country as an emerging hub in the global supply chain.

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China 2.5D packaging demand surges, supporting Korean backend equipment growth

China’s semiconductor equipment market is emerging as a critical growth engine for South Korean suppliers, driven by accelerating AI deployment and tighter restrictions on US vendors. Demand for advanced packaging tools is running ahead of expectations, with high-bandwidth memory (HBM) and 2.5D packaging advancing in tandem as central pillars of future growth. At the same time, Beijing’s push for supply chain localization is reshaping competitive dynamics and limiting foreign access.

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