07
Apr
As the optoelectronics industry shifts from competition in individual components toward systems integration and higher value-added applications, optoelectronics solution provider Ennostar is focusing on two emerging sectors with long-term growth potential at the Touch Taiwan 2026 exhibition, running from April 8-10: optical communications and sensing, and automation. The company is also integrating its two core technologies of microLED and miniLED with automotive optoelectronics, presenting a comprehensive layout across four high-value application segments.
07
Apr
Global AI chip suppliers compete as TSMC remains top foundry partner
As the artificial intelligence (AI) era advances, approximately 133 companies are actively developing or selling AI chips, according to a SEMIEcosystem report citing Jon Peddie Research. Major suppliers include Nvidia, AMD, Broadcom, and Google, alongside numerous startups focusing on edge AI solutions.
07
Apr
In-depth: How DeepSeek V4 strengthens Huawei’s role in China’s AI stack
China’s push for a self-sufficient AI stack is no longer theoretical — it is entering deployment. DeepSeek’s upcoming V4 model, expected within weeks, signals a shift from experimentation to execution, linking software, chips, and policy into a single system.
07
Apr
UBTech sees losses and margins improve as humanoid robots drive 40% of revenue
Chinese humanoid robot maker UBTech significantly improved its overall gross margin and reduced losses in 2025, with full-size embodied intelligent humanoid robot sales soaring by more than 2200% year-on-year to CNY820 million (US$119 million), becoming the company’s largest revenue source.
07
Apr
MediaTek, Qualcomm reportedly cut smartphone AP orders with TSMC
Amid soaring memory prices, manufacturers have repeatedly lowered 2026 shipment targets for smartphones, PCs, and other consumer electronics, triggering a ripple effect across the supply chain. Recently, reports emerged that major Chinese smartphone brands are scaling back purchases of processors, forcing MediaTek and Qualcomm to reduce their subsequent orders with TSMC, with estimated cuts of 10-15% in wafer starts on 4/3nm processes.
07
Apr
MSScorps targets CPO demand with in-house silicon photonics test platform
MSScorps has expanded its silicon photonics (SiPh) testing capabilities in recent years and will debut its in-house “MSS HG” platform at the Electronic Production Equipment Exhibition on April 8.
07
Apr
US PIPIR advances drone-missile strategy, integrating Taiwan into ‘non-China’ defense supply chains in Indo-Pacific
Amid sustained Middle East tensions, the US is redirecting strategic attention to the Indo-Pacific region, advancing a defense industrial network among first island chain partners. Through the Partnership for Indo-Pacific Industrial Resilience (PIPIR), Washington is spearheading a shift toward localized production and allied coordination to effectively decouple regional defense networks from Chinese supply chains.
07
Apr
Innodisk revenue jumps 4x in March, first-quarter hits record
Memory module maker Innodisk extended its strong growth momentum in March 2026, reporting monthly revenue of NT$5.67 billion (approx. US$177.34 million), up 35.8% month-over-month and 484.8% year-over-year. First-quarter revenue reached NT$13.18 billion, also a record high.
06
Apr
India roundup: India ramps up electronics and chip ambitions with new approvals, local fabs, and supply chain curbs
India is accelerating its push to build a self-reliant electronics and semiconductor ecosystem, approving new component projects, supporting local display and chip manufacturing, and tightening market access for Chinese products, as rising investments, policy incentives, and global partnerships position the country as an emerging hub in the global supply chain.
06
Apr
China 2.5D packaging demand surges, supporting Korean backend equipment growth
China’s semiconductor equipment market is emerging as a critical growth engine for South Korean suppliers, driven by accelerating AI deployment and tighter restrictions on US vendors. Demand for advanced packaging tools is running ahead of expectations, with high-bandwidth memory (HBM) and 2.5D packaging advancing in tandem as central pillars of future growth. At the same time, Beijing’s push for supply chain localization is reshaping competitive dynamics and limiting foreign access.