A global surge in memory prices is disrupting the electronics supply chain, creating what manufacturers describe as 2025’s toughest pricing season. DRAM and NAND costs are rising at record speed, pressuring margins across smartphones, PCs, home NAS devices, and industrial touch terminals.

Japanese startup BIH and Chinese automotive battery firm Beijing Hoshikawa New Energy Battery Technology announced on November 26, 2025, the successful implementation of semi-solid lithium-ion battery technology in the mass production of batteries for hybrid electric vehicles (HEV). Beijing Hoshikawa has highlighted that the new batteries will be deployed in new vehicle models launched by BAIC in early 2026.

Samsung Electronics is reportedly nearing a deal with Nvidia on 2026 HBM4 pricing, aiming to match SK Hynix’s rates as the company accelerates capacity expansion and reorganizes its DRAM development teams to regain momentum in the premium AI memory market.

Competing with leading players, Cheng Mei Instrument Technology recently delivered the first CoPoS measurement and inspection equipment to the ASE Group, aiming to break KLA Corporation’s near-monopoly in the equipment market. Cheng Mei Chairman Tony Tsai stated that in recent years, the company has been aggressively entering the advanced packaging field. He estimates that in 2025, measurement and inspection equipment in the semiconductor sector will account for roughly 60–70% of revenue, with 2026 expected to exceed 70%.