Physical AI and ADAS-cockpit integration have become the two main forces driving upgrades in China’s autonomous driving and smart cockpit supply chains, according to the latest report from DIGITIMES Research. Under this trend, automakers and tech companies are accelerating the deployment of world models and LLMs, with a new wave of mass production and commercial pilot runs expected in the second half of 2026.
The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving faster in headlines than in production lines. DIGITIMES has been tracking the latest developments in TSMC’s CoPoS advanced packaging technology, with glass core substrates emerging as the most closely watched variable in that story.
According to a trademark application filed with the United States Patent and Trademark Office (USPTO), Tesla has submitted an intent-to-use application for a new product name: Megapod. The trademark explicitly covers modular data center hardware systems engineered for AI computing, and the system is designed to bundle computer servers, AI data processing hardware, networking equipment, power distribution units (PDUs), and advanced cooling systems into a single, integrated physical unit.
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