Semiconductor testing and analysis service provider Hongkang held its annual shareholders’ meeting on June 18. Chairperson Hsieh Yung-fen said the company has begun investing in a silicon photonics wafer-and-chip optoelectronic analysis platform in anticipation of growing demand for silicon photonics. The first system is expected to be installed before August 2026, followed by a second and third system by the end of 2026 and early 2027, respectively.

Taiwan’s drone exports continue to gain momentum, driving local manufacturers to expand overseas more aggressively. But as they enter foreign markets, Taiwan companies face long local certification timelines and other regulatory hurdles, pushing their overseas strategies away from simple exports and toward localized production and joint ventures.