Huawei’s Ren says failed Motorola deal set stage for chip self-reliance

Since Huawei established Shenzhen HiSilicon Semiconductor in 2004, its semiconductor business has supported over two decades of development and innovation within Huawei’s product ecosystem. However, from 2000 to 2003, Huawei faced one of its most challenging periods and nearly became a US company. CEO Ren Zhengfei confirmed this long-rumored episode during an interview.

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AI data centers turn to high-voltage direct current as new power backbone

The global artificial intelligence (AI) boom is not only driving demand for AI servers and AI data center hardware construction but also pushing high-voltage direct current (HVDC) to become the future mainstream in power supply due to the AI sector’s massive energy consumption. This shift is accelerating investments from power grids, heavy electrical equipment, and power supply manufacturers, while the technical and capital barriers are expected to trigger a new round of market shakeouts.

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NVIDIA’s Rubin CPX may reshape AI memory demand, boosting GDDR7 over HBM

Nvidia is preparing a potential shake-up in the AI semiconductor memory market with the introduction of its next-generation AI processor, Rubin CPX, which is designed for large-context processing workloads and expected to debut in late 2026. Unlike its flagship AI accelerators that rely on HBM, Rubin CPX will feature 128GB of GDDR7, a move that industry observers say could rebalance demand between the two leading memory types, according to SemiAnalysis, Wide Daily, and ET News.

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Taiwan panel makers see modest August gains but warn of weak second-half demand

Coretronic and Radiant Opto-Electronics recorded revenue increases in August compared to July, though their year-over-year performances show declines. Looking ahead to the third quarter of 2025, Coretronic anticipates growth in shipments of energy-saving products but expects imaging product shipments to fall. Radiant projects third-quarter revenue to remain flat relative to the second quarter, with weaker performance forecasted for the second half of the year.

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Chipmakers bet big on AI glasses as market momentum builds

Although the AI glasses market has yet to experience clear explosive growth, major system manufacturers, brands, and startups are continuously increasing their resources and development efforts for new products and solutions. Chipmakers share this high level of anticipation toward the technology trend, marking a stark contrast from their previous cautious stance regarding short-term mass adoption.

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Energy and intelligence: a new benchmark in AI competition

AI giants are shifting the global competition in large language models (LLMs) away from benchmark dominance toward sustainability and real-world applicability, signaling a new phase in how artificial intelligence performance is measured. The move highlights rising concerns about energy use, environmental impact, and user experience as essential evaluation metrics.

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Taiwan’s government-built 12-inch fab to come online in 2028, integrating industry and academia capabilities

TSMC has donated several sets of used 12-inch chipmaking equipment to the government, which has had the Industrial Technology Research Institute (ITRI) under the Ministry of Economic Affairs (MOEA) and the Taiwan Semiconductor Research Institute (TSRI) under the National Institute of Applied Research (NIAR) receive them on its behalf. TSRI has selected a site on the campus of National Yang Ming Chiao Tung University (NYCU) to build a 12-inch wafer fab where proof-of-concept and pilot lines will be installed using the equipment. The facility is expected to officially commence operations in 2028.

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