21
Oct
21
Oct
China smartphone industry, 3Q 2025
Chinese smartphone shipments reached 177 million units in the third quarter of 2025, and shipments are expected to increase by 7.5% quarter-on-quarter in the fourth quarter.
21
Oct
Chinese iPhone users take on Apple, accuse it of abusing market power for App Store
Fifty-five iPhone and iPad users in China have filed a joint complaint with the State Administration for Market Regulation (SAMR), accusing Apple of abusing its dominant position by requiring all app transactions to go through its official App Store. The complaint also challenges Apple’s mandatory in-app purchase (IAP) system, which imposes commissions of up to 30%, according to Reuters and Sina.
21
Oct
Taiwan’s drone industry value doubles in two years
Chinese drone maker DJI had once dominated over 70% of the global consumer drone market and as much as 90% in the US. However, Taiwan’s domestic drone makers in recent years have begun to shine in the dual-use (civilian and military) market. The industry’s production value surpassed NT$5 billion (approx. US$163 million) in 2024 and is expected to exceed NT$10 billion in 2025.
21
Oct
Arm expands Flexible Access program to Armv9 platform to boost edge AI startups
Arm has extended its Flexible Access licensing program to include the latest Armv9 edge AI platform, enabling companies to access chip design tools at minimal cost and accelerate AI chip development and validation.
21
Oct
Nexperia meltdown jolts auto industry, triggers rush for power devices
Dutch chipmaker Nexperia has accused its suspended chief executive, Zhang Xuezheng (also known as Wing Zhang), of spreading “falsehoods” and taking “unauthorized actions,” intensifying a corporate and geopolitical confrontation that now spans China, Europe, and the global automotive supply chain.
21
Oct
Global Electronics Association joins AMD and ASE to encourage advanced packaging standardization at IMPACT 2025
The Global Electronics Association (GEA) participated as a co-organizer in the 2025 International Microsystems, Packaging, Assembly, and Circuits Technology (IMPACT) Conference, hosting a special forum, “Component to System-Level Integration.” The session brought together leading companies, including AMD, ASE Group, Kinsus, and Wistron, to discuss the development and standardization needs of advanced packaging technologies in the AI era.
21
Oct
India moves from component-level XR optics to full-stack manufacturing
India’s efforts to establish itself in next-generation electronics manufacturing have taken a major step forward, as QWR Interactive Solutions and Kaynes Technology announced plans for what they call the country’s first integrated waveguide-and-XR device manufacturing hub.
21
Oct
Pegatron’s ASRock Rack nears IPO with surging AI server sales as Chairman T.H. Tung signals more spin-offs
Pegatron Group’s server subsidiary ASRock Rack is preparing to go public, marking a key milestone in the group’s broader transformation. Pegatron Chairman T.H. Tung personally attended ASRock Rack’s pre-IPO investor meeting on October 20 to show his support, joking that he came to embrace his “golden grandson.” Tung also revealed that more subsidiaries are preparing for spin-offs following ASRock Rack’s listing, signaling an active restructuring drive within the group.
21
Oct
The quiet duopoly powering AI server substrates: Taiwan and Japan’s next supply edge
Eclat Forever Machinery (EFM), a Taiwan-based maker of advanced IC substrate equipment, told investors it expects stronger performance in 2026 than in 2025. Chairman Chou Cheng-chun said demand from major AI server chipmakers remains strong, driving Taiwan’s IC substrate leaders to commit billions of New Taiwan dollars to capacity expansion. Combined with EFM’s push to diversify its product portfolio, the company expects steady growth momentum ahead.