Taiwan air cargo volume set to hit historic peak in 2026, driven by AI and chip exports
Fiberglass crunch spurs supply scramble as CCL makers ban order changes
As AI chip package sizes continue to grow, warpage issues in IC substrates have become more pronounced. Capacity constraints for low-CTE fiberglass cloth, a critical material used to address warpage, are forcing end customers, including Apple, Nvidia, Google, and AWS, into increasingly intense competition for supply, industry sources said.
Solum Advanced Materials develops ultrathin stainless steel foil for all-solid-state batteries
China rolls out trade-in subsidies again to support ICT device sales
AMI Labs in talks for EUR3 billion valuation in effort to challenge dominant AI models
OpenAI and ServiceNow partner to embed AI models and agents into enterprise workflows
MFTBC, Foxconn to form joint venture for e-bus manufacturing
Mitsubishi Fuso Truck and Bus Corporation (MFTBC), a major Japanese commercial vehicle maker, has announced to establish a joint venture with Taiwan-based Foxconn.
Why Sony finally let go of TVs
Sony Group has decided to spin off its TV business and place it into a joint venture controlled by TCL, marking the company’s formal retreat from a segment that once defined Japan’s consumer-electronics prowess. The move underscores Sony’s strategic pivot toward higher-margin businesses—gaming, music, and film—while reflecting a broader, decades-long withdrawal by Japanese firms from mass-market home appliances.
How Sony-TCL tie-up could chip away at Samsung’s OLED advantage
Sony’s decision to form a TV joint venture with TCL is being read in South Korea less as a routine corporate reshuffle than as a structural challenge to the country’s long-held dominance in premium TVs and OLED panels. The deal has triggered unease not only about Sony’s future role in TVs, but about whether Samsung Electronics can continue to dictate the industry’s technological and competitive agenda.