Intel demonstrates cutting-edge 18A process for non-x86 SoCs, aiming to challenge TSMC

Intel has showcased a non-x86 reference system-on-chip built on its Intel 18A process, underscoring the US chipmaker’s commitment to expanding its most advanced manufacturing technology across a broader range of markets while winning more customers for Intel Foundry Services. In a newly released video, the company presented the prototype as proof that 18A can serve not only its upcoming Panther Lake processors but also designs from external clients, potentially including Apple’s M-series, Qualcomm’s Snapdragon line, and Nvidia’s Grace CPUs.

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China commands 60% of global AI patents, races to close US gap in computing power

China is entering the second half of 2025 by reviewing its “14th Five-Year Plan” technology milestones and mapping priorities for the upcoming “15th Five-Year Plan.” Liu Liehong, administrator and director of the National Data Administration (NDA), said on August 14 that by June 2025, China’s total computing power ranked second worldwide and the country held 60% of global AI patents, underscoring its rising weight in AI R&D.

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China breaks neutral atom quantum record, showcasing AI’s role in next-gen computing

The quantum research team at the University of Science and Technology of China (USTC) has set a new world record. Academic administrator Jianwei Pan and Professor Chao-Yang Lu from USTC collaborated with the Shanghai Research Center for Quantum Sciences and researcher Han-Sen Zhong’s team from Shanghai AI Laboratory. Using artificial intelligence (AI) technology, they successfully constructed defect-free two-dimensional (2D) and three-dimensional (3D) atomic arrays consisting of 2024 atoms within 60 milliseconds, breaking the global record for neutral atom quantum systems.

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Applied Materials faces lawsuit from smaller Chinese rival

Chinese semiconductor equipment makers are increasingly taking the offensive in protecting their technology and intellectual property. Beijing E-Town Semiconductor Technology has sued US chipmaking equipment leader Applied Materials in the Beijing Intellectual Property Court, alleging the illegal acquisition and use of its core trade secrets, and is seeking CNY99.99 million (US$13.9 million) in damages.

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