15
Aug
The US government is expected to announce its tariff policy this week on semiconductor-related products—including smartphones, laptops, and surveillance devices—sending ripples of uncertainty through the global tech industry. A proposed 25% tariff on smartphones is now formally under consideration, placing the strategies of Samsung Electronics and Apple under intense scrutiny.
15
Aug
Tariff exemption for semiconductors and ICT products prioritized in negotiations for Taiwanese government
The US government, under Section 232 of the Trade Expansion Act, has imposed tariffs on imports such as steel and aluminum products, automobiles, auto parts, and copper products, citing national security concerns. On August 7, 2025, it announced a 100% tariff on semiconductor products, with exemptions granted to those already manufacturing or committed to manufacturing in the US.
15
Aug
AI boom fuels Foxconn’s best-ever second quarter; growth to accelerate in Q325
Foxconn, the world’s largest electronics manufacturer, reported record second-quarter results on August 14, 2025, with revenue, operating profit, and net income all reaching historic highs for the period. The company credited surging demand for AI servers and expects strong momentum to continue into the third quarter. However, rotating CEO Kathy Yang also flagged ongoing trade tariffs and currency fluctuations as key risks to monitor.
15
Aug
Legacy carmakers shift to pragmatic platform partnerships as SDV landscape evolves
As the tide of Software-Defined Vehicles (SDVs) rises, mainstream automakers from Europe, North America, Japan, and South Korea are quietly recalibrating their strategies. Having initially gambled on full-scale, self-developed software platforms—fearing they’d be reduced to low-margin hardware suppliers—they are now embracing a more pragmatic approach.
15
Aug
Taiwan’s motor driver IC makers capture AI server market share
Taiwan’s IC design houses are seeing steady returns from years of investment in motor driver ICs, with demand rising across a wider set of applications and competition intensifying.
15
Aug
Minebea Mitsumi raises Shibaura Electronics tender offer, matching Yageo’s bid
Minebea Mitsumi has increased its tender offer bid (TOB) for shares of Shibaura Electronics to JPY6,200 (US$41.99) per share, matching the bid made by Taiwanese company Yageo Corporation. The TOB period has been extended to August 28, 2025.
15
Aug
Can Tesla’s chip shift uplift Samsung foundry services?
Over the past two weeks, Tesla CEO Elon Musk has promoted his company’s new partnership with Samsung Foundry for manufacturing its AI chips. At one point, South Korean media speculated that Samsung might even take over exclusive foundry orders for Tesla’s Dojo chips originally handled by TSMC, only to discover later that Musk had decided to shut down the supercomputer project.
15
Aug
Qisda reports mixed impact from US tariff timing and currency fluctuations
Qisda held its earnings call on August 14, revealing that its second-quarter revenue was boosted by customers pulling forward orders as a precaution against anticipated US tariffs. While this strategy increased sales in the second quarter, it also led to elevated inventory levels, further complicated by the appreciation of the New Taiwan dollar.
15
Aug
E Ink’s record 2Q25 eyed as an upward climb, with capacity expansion underway
E Ink Holdings is riding a wave of strong demand for its electronic paper displays. During its earnings briefing on August 13, CEO Johnson Lee acknowledged that the company’s production capacity has been thoroughly eclipsed by customer demand. He projected that the second quarter would mark the year’s revenue peak, with the third quarter likely holding steady, albeit not exceeding the second quarter, and the fourth quarter experiencing some deceleration—possibly pushing some volume into early 2026. Overall, however, Lee assured that 2025 would see solid operational performance, with momentum carrying into 2026.
15
Aug
Taiwanese firms secure M9-grade CCL certifications as ASIC server demand surges
In response to the global surge in large-scale AI computing power deployment, the usage and value of PCBs for AI servers have significantly increased. High-end copper-clad laminate (CCL) is evolving as next-generation AI servers upgrade their transmission architecture to 1.6 terabit rates. With increasingly stringent demands for high-frequency, high-speed, and low-loss materials, board requirements are expected to officially advance from M7 and M8 grades to the M9 grade.