Samsung Electronics’ preliminary earnings have shaken financial markets. Drawing on a report from a US brokerage, DIGITIMES Intelligence analyst Luke Lin examined the actual progress of advanced-node capacity expansion at TSMC, Intel, and Samsung, arguing that market expectations in several areas have run ahead of reality.
India’s smartphone buyers are increasingly turning to financing, a shift that could shape device sales patterns in other price-sensitive markets as well. Higher handset prices and easier installment options are making monthly payments more attractive than one-time purchases, especially beyond major cities, according to Counterpoint Research.
Apple and Broadcom have extended their custom-chip partnership through 2031 under agreements expected to exceed US$30 billion, reinforcing Broadcom’s position as a critical Apple chip supplier.
Luxshare Precision’s highly anticipated Hong Kong debut got off to a shaky start despite securing the city’s largest IPO of 2026, underscoring investor skepticism over the Apple supplier’s long-term transformation strategy.
TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly output will reach at least 200,000 wafers in 2027. Equipment makers are still waiting for TSMC to finalize order allocation, a delay that is raising fears of price-cutting competition and delivery delays, as lead times run at least seven to nine months.
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