Machvision expands early to chase NT$10B revenue

Machvision is expanding capacity earlier than planned to meet rising demand from semiconductors, substrates, and optical modules, while tight computer numerical control (CNC) and machining supply chains have emerged as its biggest operating challenge. The inspection equipment maker is reshaping its Hsinchu and Kunshan facilities and expects the new footprint to support NT$10 billion (US$313.03 million) in revenue starting in 2027.

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Topco opens Fukuoka office to link Japan chip hubs

Topco Scientific said its Japanese subsidiary, Shunkawa, officially opened its Fukuoka office on October 1, making it the company’s third base in Japan alongside its Tokyo headquarters and Kumamoto office. The move is designed to leverage Fukuoka’s location and industrial clustering to strengthen real-time technical support and new business development in Kyushu’s semiconductor hub.

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Shinko Electric acquires JDI’s Mobara Fab to expand AI packaging capacity

Shinko Electric Industries announced on September 30 it has signed a purchase agreement to acquire the Mobara Fab from Japan Display (JDI) in Mobara City, Chiba Prefecture. The transaction is intended to establish a new core production hub dedicated to high-end semiconductor packaging, addressing surging global demand for AI accelerators and data center applications.

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ASE expands smart OSAT push with six university research partnerships

Advanced Semiconductor Engineering (ASE) held its 11th Automation Industry-Academia Project Results Presentation on September 30, unveiling 12 technology projects developed with six Taiwanese universities as it works to advance smart outsourced semiconductor assembly and test (OSAT) and digital manufacturing. The projects were designed to support semiconductor factory efficiency, quality control, resilience, and climate adaptation.

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