Kemflo strengthens water resilience for semiconductor fabs

As the global electronics and advanced semiconductor manufacturing sectors expand in 2026, the stability of semiconductor and electronics plant utilities systems has become critical to meeting new factory construction schedules. Kemflo Group CEO Eugene Lin pointed out that, leveraging its integrated strengths across water resources, industrial water treatment, and metal products, Kemflo is establishing itself as an indispensable high-end water treatment partner amid labor shortages in plant operations.

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Wage protests in Northern India disrupt electronics output as Uttar Pradesh raises pay

Worker protests broke out in mid-April across the Noida–Greater Noida industrial belt, a major center for smartphone and electronics manufacturing, disrupting factory operations and prompting a government response. The demonstrations were concentrated in industrial zones such as Phase-2 and Sector 60, where thousands of workers gathered to demand higher wages and improved working conditions.

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At 360° Mobility Show, Taiwan pushes integrated automotive future

To more fully showcase Taiwan’s role in the global mobility industry, three of its flagship trade shows—Taipei AMPA, E-Mobility Taiwan, and Autotronics Taipei—were combined in 2026 into a single platform, the 360° Mobility Mega Shows. Taiwan External Trade Development Council Chairman James C. F. Huang said Taiwan’s automotive components exports have reached NT$214.6 billion, while total automotive output stands at roughly NT$500 billion (approx. US$15 billion). Only by integrating these strengths into a comprehensive ecosystem, he argued, can Taiwan expand its presence in global markets.

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ASE’s CoPos advanced packaging accelerates as Skytech and CMIt boost equipment deliveries

AI and high-performance computing (HPC) are driving increasingly stringent chip performance demands, marking a pivotal shift in advanced packaging technology from traditional wafers to large-size panels. Semiconductor equipment leader Skytech’s CEO George Yi announced that its self-developed 310x310mm panel-level packaging physical vapor deposition (PLP PVD) system, a world first, has completed delivery and been successfully integrated into production lines at major OSAT firms including ASE Technology Holding.

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