‘Hardware is sexy again’: Plug and Play CEO says AI boom has finally fulfilled his 2006 semiconductor dream

The building where Saeed Amidi runs his global venture empire was once one of the most important semiconductor facilities on the West Coast. Philips Electronics operated a fabrication plant here in Sunnyvale, California, employing 8,000 people at its peak. Then, like much of America’s chip manufacturing base, it moved to Asia — to Taiwan, to Korea, to the supply chains that would come to define the global electronics industry for the next three decades.

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Analysis: Who’s who at the trillion-dollar feast— Jensen Huang’s Taipei dinners map AI’s supply chain

When Nvidia CEO Jensen Huang stepped off a plane in Taipei on Saturday, May 23, he had already begun documenting the trip on X — night markets, fried food, and family. By the time he hosted more than 30 executives at a brick-walled restaurant six days later, the week had traced something much larger than a Computex schedule. It had mapped, dinner by dinner and post by post, the anatomy of the world’s most consequential AI supply chain.

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Google-backed robot startup tests E Ink electronic paper for humanoid skin

The humanoid robotics industry is looking beyond mechanical structures for its next wave of innovation, with materials emerging as a potential focus for new market opportunities. A Google-backed humanoid robot startup is exploring electronic paper as a next-generation display technology for robot skin, with Taiwan-based E Ink Holdings (EIH) entering the supply chain.

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Airoha deepens focus on networking and wireless edge AI

Airoha Technology is sharpening its strategy around global networking and edge AI chips, aiming to expand its customer base and strengthen its competitive moat. The MediaTek subsidiary is targeting infrastructure, audio, and positioning markets with products already shipping, in production, or advancing through development milestones that could matter to users and operators worldwide.

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Chinese power chipmaker China Resources Microelectronics targets AI servers with PLP packaging

Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.

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Foxconn says its quantum computing unit aims for commercial takeoff around 2030

Foxconn has said its quantum computing work is drawing international attention, but the main challenge remains turning research into a commercial business. The company’s quantum efforts could take about three years to reach an inflection point, with broader business potential expected around 2030, which may matter for industries and researchers worldwide.

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