17
Jun
InnoScience Technology, a leading China-based integrated device manufacturer (IDM) in gallium nitride (GaN), has won a sweeping victory in the latest patent ruling against global power component leader Infineon in China. Supply-chain sources said the two sides’ GaN patent fight has stretched from the US and Germany to China, and the ruling makes it even harder for Infineon within China’s increasingly cutthroat market.
17
Jun
Kaynes’ Japan push signals India’s bid to become an alternative chip packaging hub
India-based Kaynes Technology is seeking outsourced automotive semiconductor orders in Japan, a move that could help establish a foothold for Indian backend chip manufacturing in a market long dominated by East Asia. Japanese partners are backing the effort, but the company still faces strict quality hurdles.
17
Jun
China PCB maker DSBJ bets US$1.2 billion on AI optical modules
Suzhou Dongshan Precision Manufacturing (DSBJ) will invest US$1.2 billion to expand optical chip and optical module capacity at Source Photonics, accelerating its shift from PCB manufacturing into AI data center optical communications.
17
Jun
D-Link bets on AI therapy robots, targeting 100,000-unit shipments in 2027
D-Link is accelerating its transformation from a networking equipment brand into a broader AI and connectivity company, with CEO CJ Chang saying 2026 will mark the company’s “rebirth” after years of restructuring.
16
Jun
Samsung reportedly moves closer to 5nm-class MRAM as TSMC advances its roadmap
Samsung Electronics has secured key technology for a 5nm-class magnetoresistive random-access memory cell, according to Korean financial daily Sedaily, moving ahead just four months after presenting what it described as the world’s first 8nm-class MRAM at an international conference.
16
Jun
AI chip race sends semiconductor equipment sales to record US$36.55 billion
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced packaging capacity, according to the latest Worldwide Semiconductor Equipment Market Statistics report from SEMI.
16
Jun
ASML, TSMC, and imec move 2D transistors closer to manufacturing reality
ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, the partners unveiled a 300mm wafer integration flow that produced both n-type and p-type 2D-material transistors at a 50nm contacted poly pitch (CPP), marking the first time such scaled devices have been demonstrated using an industry-compatible process.
16
Jun
Nvidia sells US$25 billion in bonds as investors seek foothold in AI boom
Nvidia launched a sale of US$25 billion worth of high-grade bonds on June 15, ultimately garnering up to US$85 billion in orders, or more than triple the bond’s original size. This is one of several debt offerings this year from tech giants, which are responding to investor excitement and a need for cash to capitalize on the AI boom.
16
Jun
China’s Nexchip breaks into foundry top eight after AI demand lifts market to record numbers
AI, high-performance computing, and early pull-ins from TV, PC, and notebook supply chains pushed the global foundry market to a record high in the first quarter of 2026. China’s Nexchip Semiconductor delivered the key ranking shift, overtaking Taiwan’s Vanguard International Semiconductor (VIS) for the first time to become the world’s eighth-largest foundry.
16
Jun
Western Europe auto output set to fall by one-third by 2030, with Germany hit hardest
Western Europe’s auto industry is facing a deeper relocation shock, with passenger car and light commercial vehicle production projected to shrink by about one-third between 2015 and 2030 under pressure from slower-than-expected automotive electronics and electrification progress, geopolitics, trade tensions, and the shift toward localized manufacturing.