Xpeng Motors, often described as “China’s Tesla,” is advancing on two very different international fronts — cautious and measured in South Korea, but increasingly strategic in Europe — while competing Chinese EV peers such as Zeekr accelerate their own overseas expansion.

India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel’s first significant participation in India’s semiconductor manufacturing ecosystem beyond its existing design and technology operations.

At the Nvidia AI Factory MGX Ecosystem Showcase in Taipei, Taiwan, on May 29, Nvidia CEO Jensen Huang said that to meet the strong demand and support the production ramp for the next-generation Vera Rubin architecture, the company will double its artificial intelligence (AI) supercomputer capacity in Taiwan in 2026. He also thanked supply chain partners, saying he could not do it alone.

Innolux plans to accelerate its transformation in 2026, with chairman and CEO Jim Hung pointing to three priorities: advanced semiconductor packaging, smart cockpits, and higher-margin panel applications.