Four glass makers converge on 510x515mm substrate, hinting at TSMC’s next move

As AI chip sizes scale up, global glass leaders Corning, AGC, Nippon Electric Glass (NEG), and Schott have all centered their next-generation core substrate and through-glass via (TGV) roadmaps on a unified 510×515mm format. The tight alignment strongly suggests that Taiwan Semiconductor Manufacturing Co. (TSMC) is eyeing this exact specification for its post-2030 glass substrate platform.

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China OSAT share in cloud AI accelerators to hit 13% in 2026 as local ASIC volume ramps up

As China accelerates its push for homegrown AI computing chips, custom ASIC accelerators from domestic tech giants—including Huawei, Cambricon, and Alibaba—are entering volume production. These chips are being routed to Chinese OSAT providers such as JCET Group, Tongfu Microelectronics, and SJ Semiconductor (SJSemi), driving a steady expansion in Chinese OSATs’ share of the global cloud AI accelerator market.

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