Huawei’s semiconductor matriarch charges forward with dual front: chips and talent

As US-China tech tensions intensify, Huawei is accelerating efforts to achieve technological independence after being added to the US Entity List in 2019. He Tingbo, president of HiSilicon and a central figure in Huawei’s semiconductor strategy, is stepping into a pivotal role. She has been appointed head of Huawei’s Senior Talent Compensation Division, expanding her authority over executive pay and talent development, key pillars in the company’s long-term innovation agenda.

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China-based USI moves upmarket with L10 edge AI server for global clients

Universal Scientific Industrial Shanghai (USI), a China-based electronics design and manufacturing company, has completed delivery of a Level 10 (L10) full-system joint design manufacturing (JDM) project. The lightweight edge AI server, co-developed with a major international client, targets deployment in healthcare, retail, and industrial applications across Europe and North America.

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E Ink and Netronix power ahead as E-paper demand surges across segments

With customers pulling in orders ahead of schedule, E Ink Holdings expects the second quarter of 2025 to be its strongest second quarter on record — traditionally, its peak performance has come in the third or fourth quarters. The company remains optimistic about the third quarter while the fourth quarter will depend in part on clarity around global tariff policies. Nevertheless, E Ink has dubbed 2025 the “first year of large-format e-paper,” with digital signage projected to become its largest revenue stream in the near future.

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Component makers across Southeast Asia await clarity as Vietnam reaches tariff deal with US

US President Donald Trump has unveiled a trade agreement with Vietnam that reduces tariffs on Vietnamese exports to the US from 46% to 20%, while imposing a 40% levy on transshipped goods. Although the full policy details have yet to be released, connector and cable suppliers say the Vietnam deal provides a provisional reference point amid broader uncertainty over regional tariff policies.

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SEMICON Taiwan 2025 to launch AI chip packaging alliance, highlighting advanced packaging and ecosystem resilience

SEMICON Taiwan 2025 is scheduled to take place from September 10 to 12 at the Taipei Nangang Exhibition Center, with a series of technical forums kicking off on September 8. A key highlight will be the official launch of the SEMI 3DIC Advanced Manufacturing Alliance (SEMI 3DICAMA) on September 9, which will delve into critical topics such as breakthroughs in advanced packaging technologies for AI chips.

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