Latest News and Trends Archives | Page 810 of 2507 | China LCD Display Manufacturer and Supplier for Alphanumeric,Character,Graphic LCD Panel and Module

04 Jul

Taiwan’s Kenmec leverages AI simulation to slash factory build times by three months

July 4, 2025
By jeff

Kenmec Mechanical Engineering is using Nvidia’s Omniverse platform to transform factory construction, enabling “one-click deployment” that cuts build times by over three months while expanding into humanoid robots and AI server cooling systems.

04 Jul

Latest News and Trends

WiseChip subsidiary UHydrogen enters green energy sector with AEM technology transfer from NCU

July 4, 2025
By jeff

National Central University (NCU) and UHydrogen, a subsidiary of PMOLED display manufacturer WiseChip Semiconductor, have completed a technology transfer agreement involving key green hydrogen production technology. NCU has officially authorized UHydrogen to use its latest-generation Anion Exchange Membrane Water Electrolysis (AEM-WE) technology for hydrogen production.

04 Jul

Latest News and Trends

ICT design house Microprogram to make Taiwan Stock debut

July 4, 2025
By jeff

Taiwanese ICT design house Microprogram Information will list on the Taiwan Stock Exchange at the end of July 2025, taking a further step into the capital market.

04 Jul

Latest News and Trends

Tata and Tower Semiconductor reportedly shortlisted for India’s SCL upgrade

July 4, 2025
By jeff

Tata Semiconductor and Tower Semiconductor have advanced to the financial bidding stage to modernize the Semiconductor Laboratory (SCL) in Mohali, Mint reports. The shortlisted firms will compete to upgrade the facility’s outdated 180nm chip line with advanced equipment and long-term support.

03 Jul

Latest News and Trends

Intel plans to abandon in-house glass substrate development, shift to external procurement

July 3, 2025
By jeff

According to Computerbase, under the leadership of new CEO Lip-Bu Tan, Intel might no longer push forward with in-house R&D of glass substrates but instead turn to purchasing ready-made solutions from specialized suppliers. This move is expected to help Intel accelerate the launch of viable products while diversifying risks and maintaining flexibility to switch suppliers.

03 Jul

Latest News and Trends

US unleashes Section 232 tariffs, global trade talks in disarray

July 3, 2025
By jeff

With the July 9, 2025, deadline for new tariffs fast approaching, trade talks between the US and key partners like Japan, India, and France are showing signs of strain. At the heart of the deadlock lies Washington’s increasingly aggressive use of Section 232 tariffs, a tool with far greater bite than traditional reciprocal duties.

03 Jul

Latest News and Trends

Details of the US-China trade agreement remain unclear, with no consensus on rare earths and chip controls

July 3, 2025
By jeff

On June 26, 2025, US President Donald Trump announced that the US had signed a trade agreement with China on June 25, which was also confirmed by China’s Ministry of Commerce. From the talks in Geneva on May 11 to negotiations in London on June 10, followed by Trump’s recent announcement, what exactly have the two countries agreed upon?

03 Jul

Latest News and Trends

Micron tightens grip on AI memory market as Samsung certification lags

July 3, 2025
By jeff

Micron Technology is stepping up its game in the competitive high-bandwidth memory (HBM) market, leveraging recent wins to boost production and capture rising demand driven by artificial intelligence (AI) platforms.

03 Jul

Latest News and Trends

ProLogium’s Taoyuan Hi-Tech Industrial Park plant drives lithium ceramic battery shipments past 2.4M units

July 3, 2025
By jeff

Next-generation lithium ceramic battery manufacturer ProLogium announced that its cumulative shipments have officially surpassed 2.4 million units as of the first half of 2025, marking a significant milestone since its inception in 2013.

03 Jul

Latest News and Trends

Samsung completes development of 1c DRAM, paving way for HBM4 rollout

July 3, 2025
By jeff

Samsung Electronics has successfully developed its sixth-generation DRAM, known as 1c DRAM, built using a 10nm class process. The product has received internal Production Readiness Approval (PRA), signaling it has met key quality and performance benchmarks and is now in the final phase before mass production. The milestone brings Samsung one step closer to its goal of mass-producing HBM4, or fourth-generation high-bandwidth memory, in the second half of 2025.

Sign in