The Semiconductor Assembly Test Automation and Standardization Research Association (SATAS), spearheaded by Intel Corporation in Japan, announced on June 19, 2025, that it has begun constructing a pilot semiconductor back-end production line at Sharp Corporation’s Kameyama facility in Mie Prefecture. In addition to equipment installation, SATAS has initiated environmental preparation work for several buildings within the site.

6月20日消息，据“合肥欣奕华”，近日，合肥欣奕华智能机器股份有限公司（以下简称“欣奕华智”）自主研发的大宽幅线源共蒸钙钛矿晶硅叠层蒸镀机正式搬入行业头部客户产线，标志着我国在钙钛矿太阳能电池核心装备领域实现重大技术突破。该设备攻克了钙钛矿“干法”工艺中的镀膜均匀性、稳定性及自动化集成三大行业难题，为晶硅-钙钛矿叠层电池GW级量产奠定了坚实基础。

6月20日消息，荣耀和中国移动于19日发布AI终端战略合作启航计划，双方围绕AI终端的产品创新、生态共建与商业模式落地展开合作，旨在共同打造开放、创新的AI终端生态，联合探索理解用户、会思考、能执行的”智能终端产品，进一步推动智能体在多终端、多系统之间的深度协同。