传彩晶也要卖厂
6月20日消息，据台媒工商时报，半导体厂在台湾地区科学园区觅地扩产，高规格的闲置面板厂房成为首要标地，继群创、友达之后，又传出联电相中彩晶南科厂房。据了解，目前群创南科五厂正在跟美光洽谈当中，友达新加坡厂也待价而沽，后续厂房出售动态仍是市场关注焦点。
20
Jun
20
Jun
消息称富士康为巩固印度iPhone供应链地位，首次涉足核心组件制造
6 月 20 日消息，金融时报昨日（6 月 19 日）发布博文，富士康首次在印度本土布局量产 iPhone 金属中框，从而巩固其在苹果印度制造战略中的地位。
20
Jun
投资550亿元，合肥8.6代AMOLED项目有了新进展
6月16日，中建一局建设发展公司官方微信发布消息称，由其承建的合肥国显8.6代AMOLED项目支持区首块屋面已于近日提前封顶，项目主体结构建设进入冲刺阶段。
20
Jun
20
Jun
京东618战报：超50款手机单品成交额破亿
数据显示，截至6月18日24点，小米、vivo、OPPO、荣耀、iQOO、一加、三星、realme、魅族、摩托罗拉、红魔、努比亚等品牌超50款手机单品成交额破亿，鸿蒙手机成交额同比增长超100%。此外，京东618开始1小时iPhone成交额突破亿元。
19
Jun
SEMICON West relocates to Arizona amid TSMC’s chip cluster expansion
SEMICON West 2025 will be held in Phoenix, Arizona, for the first time, October 7 to 9, 2025, as Taiwan Semiconductor Manufacturing Company (TSMC) continues to draw investments and talent to the state.
19
Jun
Urgent orders boost memory packaging and testing in 2Q25; AI stabilizes variables for 2H25
Benefiting from a rapid recovery in memory market demand during the first half of 2025, memory packaging and testing companies are sharing in the gains. Although the US 90-day tariff exemption period is about to expire, increasing uncertainties around order visibility starting from the third quarter are expected to make customers adopt more conservative stocking strategies.
19
Jun
Tong Yang Industry reports record revenue and profit in first five months of 2025
Tong Yang Industry’s annual shareholders meeting on June 19 showcased its 2024 business report, noting record-high consolidated revenue and profit for the first five months of 2025.
19
Jun
Taiwan tests unmanned boats in military demonstration as tensions rise
Taiwan’s National Chung-Shan Institute of Science and Technology (NCSIST) staged sea trials for unmanned vessels off the northeastern coast, bringing together 12 domestic and international companies in a display of the island’s growing autonomous maritime capabilities.
19
Jun
New front opens in CPO, SiPh race: TSMC and Taiwanese supply chain in the lead
Surging demand for AI compute is driving global investment in GPUs, ASICs, and next-generation datacenter infrastructure. As conventional electronic interconnects fall short of meeting high-bandwidth, low-latency data exchange needs, silicon photonics (SiPh) and co-packaged optics (CPO) are emerging as foundational technologies for next-generation AI system performance.