Seagate warns of data center carbon crisis as AI storage demands triple

Seagate Technology Holdings Plc warned that AI’s exploding demand for data storage is fueling a carbon crisis in data centers, even as it unveiled next-gen storage solutions at Computex 2025. The company projects that global data volume will triple between 2023 and 2028, surpassing zettabyte levels and outpacing current manufacturing capabilities. A survey of over 300 data center professionals conducted by Seagate identified high energy consumption as the top obstacle to sustainable expansion.

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Luxshare makes Suzhou epicenter of its US$4.2B push into acoustics, robotics, and wearable tech

Following a high-profile signing in February, Luxshare Precision has launched the next phase of its major project in Kunshan, Suzhou. According to the official WeChat account “Kunshan Release” on May 20, the company’s Phase I acoustic industry facility at Luxshare Science Park in Jinxi Town has commenced production, with construction on Phase II now underway.

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Chief Telecom’s premium AI data center thrives on advanced specs and flexibility, defying high pricing

As AI applications continue to fuel surging demand for computing power, Taiwan-based internet data center (IDC) provider Chief Telecom is solidifying its differentiated market position through high-specification and flexible data center designs. The company is also actively tapping into AI vertical applications to broaden its market influence.

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Jabil and AVL deal to develop next-gen vehicle electronics

On May 21, Jabil, a global manufacturing solutions provider for the automotive industry, announced that it has signed a memorandum of understanding (MoU) with AVL Software and Functions GmbH, the e-drive and software arm of AVL List GmbH. The agreement marks the beginning of a strategic collaboration aimed at streamlining the development of next-generation vehicle electronics.

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Technoprobe bolsters Taiwan expansion as local probe card makers ramp up in-house R&D

Technoprobe, a global leader in probe card manufacturing, is ramping up its presence in Taiwan with an aggressive vertical integration strategy, strengthening its connections across both upstream and downstream supply chains. The Italy-based company is positioning itself to secure a substantial share of Taiwan’s rapidly growing advanced semiconductor testing sector. Industry experts caution that if Technoprobe’s localized expansion succeeds, domestic Taiwanese probe card makers could face significant long-term competitive pressures.

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Phison’s aiDAPTIV+ aims to democratize AI at the edge

As the global AI boom moves from centralized cloud environments to the devices at the edge, Taiwan-based Phison Electronics — a leading supplier of NAND flash controllers — sees 2025 as the year for real-world deployment of edge AI. CEO Khein Seng Pua announced that the company’s proprietary aiDAPTIV+ platform has already surpassed 200 proof-of-concept (PoC) projects, including successful pilots with all three of the world’s major GPU manufacturers.

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What does Foxconn’s chip bet in France mean for Europe’s tech future?

Foxconn, the world’s largest electronics manufacturing services provider, has partnered with French defence and aerospace group Thales to establish a EUR250 million (US$272 million) semiconductor facility in France, marking the Taiwanese company’s first direct manufacturing investment in Europe and a significant step in the continent’s push for technological sovereignty.

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