Amid the growing trend toward connected, autonomous, shared, and electrification (CASE) in the automotive industry, vehicles are now much more than simply mechanical products but rather rely on contributions spanning the ICT, software, semiconductor, and optical sectors.
According to an official press release, Deca Technologies has signed an agreement with IBM to deploy its M-Series and Adaptive Patterning technologies at IBM’s advanced packaging plant in Bromont, Quebec. Under the deal, IBM will establish a high-volume manufacturing line centered on Deca’s fan-out interposer technology, known as MFIT.
Nvidia CEO Jensen Huang’s 2025 Asia tour has drawn attention not just for its high-profile stops but also for a significant omission: South Korea. While Huang celebrated the Lunar New Year in China, met with Japanese Prime Minister Fumio Kishida, and headlined Taiwan’s Computex 2025, he skipped visiting South Korea—a nation often dubbed a “semiconductor powerhouse.”
German enterprise software leader SAP has announced strategic partnerships with US-based AI search startup Perplexity and data analytics firm Palantir, aiming to advance its business AI offerings and build a more interconnected ecosystem of AI agents.