United Radiant Technology reconsiders supply chain strategy amid tariff and carbon cost risks

United Radiant Technology’s (URT) shareholder meeting on May 19 saw all proposals approved. The company noted that US President Donald Trump’s tariffs on countries with significant trade surpluses pose challenges for the global market by taxing imports. Furthermore, the EU will implement the Carbon Border Adjustment Mechanism (CBAM) in 2026, using carbon emission data from 2025, potentially increasing import costs for exports to the EU.

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As Nissan falters, Toyota may offer lifeline in quiet, government-backed move

Once a pillar of Japan’s automotive might, Nissan now finds itself in financial peril, with talks of potential mergers or alliances repeatedly falling through. After a failed merger attempt with Honda, Japan’s second-largest automaker, reports from Japanese media suggest that Toyota—Japan’s largest and most influential carmaker—may be quietly extending a helping hand. However, neither Toyota nor Nissan has confirmed the rumors through official channels.

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Microsoft sharpens focus on AI platform centrality with multi-model hosting push

At its Build developer conference, Microsoft signaled a strategic pivot toward becoming a central hub for artificial intelligence development. According to Reuters, the company announced that its Azure cloud will host a broad range of AI models, including offerings from xAI, Meta Platforms, Mistral AI, and Black Forest Labs. This move positions Microsoft as a neutral AI platform provider, expanding its ecosystem beyond its existing deep ties with OpenAI.

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Nvidia courts ASIC allies with NVLink Fusion, so why is Broadcom still saying no?

At this year’s COMPUTEX keynote, Nvidia CEO Jensen Huang unveiled NVLink Fusion, a new initiative to open the company’s proprietary NVLink interconnect to third-party ASICs and CPUs. Huang underscored his goal of “doing business with every customer.” Notably absent from the list of launch partners was ASIC and networking chip powerhouse Broadcom.

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Broadcom unveils third-gen CPO technology to power AI’s next leap

Semiconductor giant Broadcom has introduced the third generation of its co-packaged optics (CPO) technology, significantly advancing the capabilities of high-speed data transmission critical to artificial intelligence (AI) infrastructure. The new solution doubles the transmission speed to 200 Gbps per lane, while dramatically improving energy efficiency and cost.

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Computex 2025: Supermicro pushes AI growth and efficiency amid ongoing Nvidia chip shortage

During his keynote speech at Computex 2025, Supermicro president and CEO Charles Liang once again pressed Nvidia CEO Jensen Huang for faster product deliveries. Huang joked that every time he appears on stage, Liang asks him for shipments. According to industry sources, even with expanded capacity, Nvidia’s Blackwell chips remain in short supply.

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AI agent race heats up: cross-system integration and standardization key to widespread adoption

In a keynote on May 19, 2025, Nvidia CEO Jensen Huang focused on AI infrastructure, AI agents, and physical AI (robots). He highlighted that AI agents require significantly more computing power than one-shot AI. While cloud providers have launched AI agent services, the key challenge for widespread adoption is achieving cross-system integration and standardization.

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