TSMC is fast-tracking its capacity expansion with plans to build nine new facilities in 2025, including eight wafer fabs and one advanced packaging plant. The move has energized sentiment across its supply chain. Advanced Echem Materials Company (AEMC) Chairman Chan Wen-hsiung said the firm had already anticipated this expansion, citing new capacity at its Tainan and Kaohsiung facilities as sufficient to support customer needs through 2030. A US plant is not under consideration before then and would only be evaluated after that timeline.

Nvidia CEO Jensen Huang announced an expanded collaboration with Foxconn and the Taiwan government to develop an AI factory, a project that will utilize 10,000 Nvidia GB300 GPUs.

5月20日消息，市场研究机构Canalys发布报告称，2025年第一季度，中东地区智能手机出货量为1170万部，同比下降4%。尽管2024年市场曾强劲复苏，但2025年初受零售需求放缓及消费者态度趋于谨慎的影响，整体市场出现回落。