Ennostar preps 30-inch transparent Micro LED window display for smart vehicles

Ennostar, a leading developer in compound semiconductors, showcased major advancements in Micro LED technology at Touch Taiwan 2025, with a dual focus on innovation at both the component and application levels. The centerpiece of its exhibition included a cutting-edge GemiLED platform and a transparent 30-inch automotive display now ready for mass production.

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Taiwan accelerates unmanned vehicle push amid global defense and tariff tensions with the US

As global trade grapples with the turbulence of tariff disputes, defense and military demands remain undeterred, emerging as pivotal bargaining chips in negotiations over reciprocal tariffs with the US. Unmanned vehicles have surged to the forefront of strategic priorities, with Taiwan’s drone industry already coalescing into a nascent national team.

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JEDEC rolls out HBM4 standard: 2TB/s memory poised to supercharge AI, HPC

The global push to meet surging demand from AI, high-performance computing (HPC), and advanced data centers has reached a new milestone. JEDEC, the international semiconductor standards organization, has unveiled the High Bandwidth Memory 4 (HBM4) specification—a next-gen memory standard featuring major architectural and interface upgrades for dramatically improved bandwidth, capacity, and power efficiency.

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Chips, China, and Congress: Nvidia and Jensen Huang’s high-stakes diplomatic balancing act

Nvidia CEO Jensen Huang returned to China this week in a markedly more high-profile visit than before. According to the Financial Times, he is expected to meet with DeepSeek founder Liang Wenfeng to explore the joint development of next-generation AI chips tailored for China—designed to align with export controls imposed by both Washington and Beijing.

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