BOE pivots beyond displays to glass substrate packaging, perovskite solar

BOE Technology chairman Chen Yanshun revealed at the 2025 BOE Investor Day that the company will pivot toward glass substrate packaging and perovskite solar cell (PSC) technology as strategic growth drivers. The initiative targets high-value semiconductor backend processes and automotive electronics, aiming to diversify beyond BOE’s maturing display business.

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Exclusive: US drone makers Skydio, Anduril turn to Taiwan for key supply chain support

A wave of next-generation defense contracts from the US Department of Defense is poised to transform the global unmanned systems industry in 2025, and Taiwan may play a pivotal role. With the Pentagon expected to release a large volume of unmanned vehicle orders next year, US defense tech startups are racing to secure production capacity. Many of these firms, while brimming with innovation, face significant constraints in manufacturing scale, opening the door for Taiwan’s precision-driven, China-free supply chain.

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Tariffs impact economy, but AI servers remain an exception, says Wistron

Wistron president and CEO Jeff Lin stated that AI servers represent a rigid demand and are not affected by reciprocal tariffs. However, mature consumer products such as notebooks and smartphones are likely to face challenges due to tariff impacts. Lin also revealed that in response to the US reciprocal tariffs, Wistron has prepared multiple contingency plans labeled Plan A, B, C, D, and E, although details of the tariffs remain unclear and customers have yet to provide definitive instructions.

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Intel cuts jobs at Israel’s Fab 28 as new CEO rethinks global footprint

Intel has initiated job cuts at its Fab 28 wafer fabrication plant in Kiryat Gat, Israel, marking the first time the facility—one of the chipmaker’s three largest global manufacturing hubs—has been affected by broader company-wide downsizing. The move comes as new CEO Lip-Bu Tan accelerates efforts to streamline Intel’s sprawling global operations and eliminate organizational inefficiencies.

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Next-gen semiconductor push: SK Hynix prepares laser cutting overhaul for ultra-thin wafers

As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation for next-generation HBM4 and NAND flash memory exceeding 400 layers, SK Hynix is reportedly preparing to overhaul its wafer dicing technologies — a foundational step in semiconductor production that is becoming increasingly difficult due to thinning wafers.

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Smartphone brands expand AI adoption to mid-to-high-end models to boost sales in 2H25

As the third quarter of 2025 kicks off, smartphone brands around the world are rolling out new models, hoping to rejuvenate the sluggish market as inflation, currency swings, and trade tensions continue to weigh on consumer demand. While the smartphone market continues to face challenges like product maturity, high market penetration, and extended replacement cycles, making it difficult to achieve strong overall sales momentum, it’s fortunate that generative AI has boosted the industry in recent years. Brands have progressively incorporated AI functionalities into their mid- and high-end models, which has helped sustain smartphone sales.

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