45亿元注册资本已全部到位 莱宝高科MED项目预计下半年开工
6月2日，莱宝高科公布了投资者关系活动记录表。在记录表中，莱宝高科透露，微腔电子纸显示器件（MED）项目45亿元人民币现金出资的注册资本已于2024年5月29日全部到位。预计今年下半年将正式开工建设。
04
Jun
04
Jun
洛图科技：电子纸平板在2024年迎来彩色时代
但从趋势上来看，彩色屏产品的渗透正在逐年递增。2022年，彩色屏的占比仅为2.7%，2023年提升至了4.2%，2024年前四个月的表现翻倍为8.6%。
03
Jun
Microsoft makes US$3.2 billion AI bet on Swedish data centers
Microsoft Corp plans to invest $3.2 billion in artificial intelligence and cloud facilities in Sweden, its largest-ever infrastructure bet in the Nordic country drawing on the region’s rich supply of green energy.
03
Jun
EV sales defy China spending slump as price cuts lure buyers
Electric vehicles remain a bright spot in China’s auto market as manufacturers of battery-powered cars overcame a slump in consumer spending at home thanks to price cuts and new model launches.
03
Jun
China semiconductor players and techs
Despite the sanctions from the US, the Chinese government and semiconductor firms continued to step up their effort in promoting independent development of China’s semiconductor industry.
03
Jun
MediaTek announces new products for Computex, with Chromebook and new TV platform leading the way
MediaTek vice chairman & CEO Rick Tsai is set to discuss how MediaTek is driving the ubiquitous AI era during Computex 2024. Additionally, MediaTek will unveil two new chipsets: the Kompanio for high-end Chromebooks and the Pentonic 800 for 4K high-end smart TVs and displays. They will offer superior performance and AI computing capabilities in different application domains.
03
Jun
Samsung grapples with strikes and rivalry as SK Hynix ramps up investments
Samsung Electronics’ semiconductor division is under pressure, facing fierce competition from industry rivals and internal labor strikes, creating substantial hurdles for newly appointed chief Kye Hyun Kyung. Meanwhile, SK Hynix is capitalizing on its momentum, planning to significantly boost its 2024 capital expenditures to maintain its leadership in High-Bandwidth Memory (HBM).
03
Jun
China-manufactured foldable OLED shipments to surpass Samsung Display in 1H24, says Omdia
China’s flexible OLED manufacturers have been rapidly advancing their technology and boosting their shipments, posing a substantial challenge to Samsung Display’s dominance.
03
Jun
Micron’s latest HBM performance catches the eyes of South Korean competitors
Although the current High-Bandwidth Memory (HBM) market is still dominated by SK Hynix and Samsung Electronics, Micron has recently caught up rapidly. Following its earlier announcement of mass production of 8-layer HBM3E, reports suggest that its new-generation product demonstrates excellent power efficiency performance.
03
Jun
AMD working with TSMC on 3nm chips, says Su
AMD has a close and solid relationship with TSMC on the 3nm technology, and the two companies are already working on several new product developments, according to Lisa Su, chairperson and CEO for the processor vendor.