Huawei rotating chairman Eric Xu said the company’s Ascend AI accelerators have surpassed Nvidia in both sales and market share in China, highlighting how US export controls on advanced AI chips are accelerating the shift of China’s data center and AI industries toward domestic suppliers.

As AI chip sizes scale up, global glass leaders Corning, AGC, Nippon Electric Glass (NEG), and Schott have all centered their next-generation core substrate and through-glass via (TGV) roadmaps on a unified 510×515mm format. The tight alignment strongly suggests that Taiwan Semiconductor Manufacturing Co. (TSMC) is eyeing this exact specification for its post-2030 glass substrate platform.

China’s rapid expansion of AI applications is driving a fresh wave of data center construction. SemiAnalysis estimates that the country has already delivered more than 24GW of data center capacity and will remain above that level by the end of 2026, making China the world’s second-largest data center market after the US.